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STM32F732ICK6 Datasheet(PDF) 114 Page - STMicroelectronics |
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STM32F732ICK6 Datasheet(HTML) 114 Page - STMicroelectronics |
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114 / 122 page ![]() Package information STM32F732xx STM32F733xx 114/122 DocID028480 Rev 1 Figure 36. UFBGA176+25, 10 x 10 mm x 0.65 mm, ultra fine-pitch ball grid array package recommended footprint Table 21. UFBGA176+25 recommended PCB design rules (0.65 mm pitch BGA) Dimension Recommended values Pitch 0.65 mm Dpad 0.300 mm Dsm 0.400 mm typ. (depends on the soldermask reg- istration tolerance) Stencil opening 0.300 mm Stencil thickness Between 0.100 mm and 0.125 mm Pad trace width 0.100 mm |
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