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VND5E008ASP-E Datasheet(PDF) 24 Page - STMicroelectronics |
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VND5E008ASP-E Datasheet(HTML) 24 Page - STMicroelectronics |
24 / 33 page Package and PCB thermal data VND5E008ASP-E 24/33 DocID023813 Rev 4 4 Package and PCB thermal data 4.1 PowerSO-16 thermal data Figure 18. PowerSO-16 PC board 1. Layout condition of Rth and Zth measurements (Board finish thickness 1.6 mm +/- 10%; Board double layer; Board dimension 77 mm x 86 mm; Board Material FR4; Cu thickness 0.070 mm (front and back side); Thermal vias separation 1.2 mm; Thermal via diameter 0.3 mm +/- 0.08 mm; Cu thickness on vias 0.025 mm). Figure 19. Rthj-amb vs PCB copper area in open box free air condition (one channel ON) |
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Similar Description - VND5E008ASP-E |
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