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VND5E050ACKTR-E Datasheet(PDF) 29 Page - STMicroelectronics |
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VND5E050ACKTR-E Datasheet(HTML) 29 Page - STMicroelectronics |
29 / 43 page VND5E050ACJ-E, VND5E050ACK-E Package and PCB thermal data Doc ID 022515 Rev 2 29/43 4 Package and PCB thermal data 4.1 PowerSSO-12 thermal data Figure 35. PowerSSO-12 PC board Note: Layout condition of Rth and Zth measurements (PCB: double layer, thermal vias, FR4 area= 77mm x 86mm,PCB thickness=1.6mm, Cu thickness=70µm (front and back side), copper areas: from minimum pad lay-out to 8cm2). Figure 36. Rthj-amb Vs. PCB copper area in open box free air condition (one channel ON) 30 35 40 45 50 55 60 65 70 02 4 6 8 10 RTHj _amb( ° C/ W) PCB Cu heat sink area ( cm^ 2) |
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