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VND5E050MCKTR-E Datasheet(PDF) 26 Page - STMicroelectronics |
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VND5E050MCKTR-E Datasheet(HTML) 26 Page - STMicroelectronics |
26 / 40 page Package and PCB thermal data VND5E050MCJ-E, VND5E050MCK-E 26/40 Doc ID 022514 Rev 2 4 Package and PCB thermal data 4.1 PowerSSO-12 thermal data Figure 32. PowerSSO-12 PC board 1. Layout condition of Rth and Zth measurements (PCB: double layer, thermal vias, FR4 area = 77 mm x 86 mm, PCB thickness = 1.6 mm, Cu thickness = 70 µm (front and back side), copper areas: from minimum pad lay-out to 8 cm2). Figure 33. Rthj-amb vs PCB copper area in open box free air condition (one channel on) 30 35 40 45 50 55 60 65 70 02 46 8 10 RTHj_amb(°C/ W) PCB Cu heatsink area (cm^ 2) |
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