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VND5E050MCKTR-E Datasheet(PDF) 29 Page - STMicroelectronics |
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VND5E050MCKTR-E Datasheet(HTML) 29 Page - STMicroelectronics |
29 / 40 page ![]() VND5E050MCJ-E, VND5E050MCK-E Package and PCB thermal data Doc ID 022514 Rev 2 29/40 4.2 PowerSSO-24 thermal data Figure 36. PowerSSO-24 PC board 1. Layout condition of Rth and Zth measurements (PCB: double layer, Thermal vias, FR4 area = 77 mm x 86 mm, PCB thickness =1.6 mm, Cu thickness =70 µm (front and back side), Copper areas: from minimum pad lay-out to 8 cm2). Figure 37. Rthj-amb vs PCB copper area in open box free air condition (one channel on) 30 35 40 45 50 55 02 46 8 10 RTHj_amb(°C/W) PCB Cu heatsink area (cm^2) |
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