MPXM2102AS datasheet(223/670 Pages) MOTOROLA

223 / 670 page

MPX4105A SERIES

3–77

Motorola Sensor Device Data

www.motorola.com/semiconductors

Figure 2. Cross–Sectional Diagram

(not to scale)

FLUORO SILICONE

GEL DIE COAT

WIRE BOND

LEAD

FRAME

STAINLESS

STEEL CAP

EPOXY

PLASTIC

CASE

DIE

BOND

ABSOLUTE ELEMENT

SEALED VACUUM REFERENCE

DIE

Figure 3. Recommended power supply decoupling

and output filtering.

For additional output filtering, please refer to

Application Note AN1646.

1.0

IPS

470 pF

OUTPUT

+5 V

0.01

GND

Vout

Figure 2 illustrates an absolute sensing chip in the basic

chip carrier (Case 867).

A fluorosilicone gel isolates the die surface and wire

bonds from the environment, while allowing the pressure

signal to be transmitted to the sensor diaphragm. The

MPX4105A series pressure sensor operating characteristics,

internal reliability and qualification tests are based on use of

dry air as the pressure media. Media other than dry air may

have adverse effects on sensor performance and long–term

reliability. Contact the factory for information regarding me-

dia compatibility in your application.

Figure 3 shows the recommended decoupling circuit for in-

terfacing the output of the integrated sensor to the A/D input

of a microprocessor or microcontroller. Proper decoupling of

the power supply is recommended.

5.0

4.5

4.0

3.5

3.0

Pressure (ref: to sealed vacuum) in kPa

MAX

MIN

2.5

2.0

1.5

1.0

0.5

Figure 4. Output versus Absolute Pressure

TEMP = 0 to 85

°C

15 kPA TO 105 kPA

MPX4105A

TRANSFER FUNCTION:

Vout = Vs* (0.01*P–0.09) ± Error

VS = 5.1 Vdc

TYP

Figure 4 shows the sensor output signal relative to pres-

sure input. Typical minimum and maximum output curves

are shown for operation over a temperature range of 0

° to

°C. The output will saturate outside of the specified

pressure range.

Freescale Semiconductor, Inc.

For More Information On This Product,

Go to: www.freescale.com

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