PIC16F74-ESLASHML datasheet(121/174 Pages) MICROCHIP

121 / 174 page

 2002 Microchip Technology Inc.

DS30325B-page 119

PIC16F7X

15.0

ELECTRICAL CHARACTERISTICS

Absolute Maximum Ratings †

Ambient temperature under bias................................................................................................................ .-55 to +125°C

Storage temperature .............................................................................................................................. -65°C to +150°C

Voltage on any pin with respect to VSS (except VDD, MCLR. and RA4) ......................................... -0.3V to (VDD + 0.3V)

Voltage on VDD with respect to VSS ............................................................................................................ -0.3 to +6.5V

Voltage on MCLR with respect to VSS (Note 2) ..............................................................................................0 to +13.5V

Voltage on RA4 with respect to Vss ...................................................................................................................0 to +12V

Total power dissipation (Note 1) ............................................................................................................................... 1.0W

Maximum current out of VSS pin ........................................................................................................................... 300 mA

Maximum current into VDD pin .............................................................................................................................. 250 mA

Input clamp current, IIK (VI < 0 or VI > VDD)

..................................................................................................................... ± 20 mA

Output clamp current, IOK (VO < 0 or VO > VDD)

............................................................................................................. ± 20 mA

Maximum output current sunk by any I/O pin..........................................................................................................25 mA

Maximum output current sourced by any I/O pin .................................................................................................... 25 mA

Maximum current sunk by PORTA, PORTB, and PORTE (combined) (Note 3) ................................................... 200 mA

Maximum current sourced by PORTA, PORTB, and PORTE (combined) (Note 3).............................................. 200 mA

Maximum current sunk by PORTC and PORTD (combined) (Note 3) .................................................................200 mA

Maximum current sourced by PORTC and PORTD (combined) (Note 3) ............................................................ 200 mA

Note 1: Power dissipation is calculated as follows: Pdis = VDD x {IDD -

∑ IOH} + ∑ {(VDD - VOH) x IOH} + ∑(VOl x IOL)

2: Voltage spikes at the MCLR pin may cause latchup. A series resistor of greater than 1 k

Ω should be used

to pull MCLR to VDD, rather than tying the pin directly to VDD.

3: PORTD and PORTE are not implemented on the PIC16F73/76 devices.

† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the

device. This is a stress rating only and functional operation of the device at those or any other conditions above those

indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for

extended periods may affect device reliability.

PIC16F74-E/ML Datasheet(PDF) 121 Page - Microchip Technology

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