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Part number
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Description
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CSPNL |
Wafer Level Packaging
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CBGA |
From innovative designs and expanding package offerings, Amkor provides a platform from prototype-to-production.
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CDIP |
Ceramic Dual-Inline Package
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CERPAK |
Ceramic Pack
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CABGA |
ChipArray짰 Packages
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CLGA |
Ceramic Land Grid Array Package
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CMCM |
Ceramic Multi-Chip Module Package
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CPGA |
Ceramic Pin Grid Array Package
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CQFP |
Ceramic Quad Flat Pack Package
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CSOIC |
Ceramic Small Outline Integrated Circuit Package
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CSSOP |
Ceramic Shrink Small Outline Package
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ETCSP |
the first ball grid array capable of an extremely thin 0.5 mm maximum mounted height.
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FCCSP |
a flip chip solution in a CSP package format.
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FLATPACK |
Ceramic Flat Pack Package
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LCC |
Leadless Chip Carrier Package
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LQFP |
Low Profile Quad Flat Pack (LQFP) Packages
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LQFPPOWERQUAD2 |
LQFP PowerQuad짰 2 Packages
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LQFPPOWERQUAD4 |
LQFP PowerQuad짰 4 Packages
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MCMPBGA |
Innovative designs and expanding package offerings provide a platform from prototype-to-production
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MQFPPOWERQUAD2 |
Exceptional thermal and electrical performance by design include the following
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MQFP |
Amkor?셲 MQFP IC package portfolio provides
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PBGA |
Innovative designs and expanding package offerings provide a platform from prototype-to-production
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PDIP |
Amkor?셲 PDIP packages offer
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PLCC |
Amkor?셲 PLCC IC package portfolio provides
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PPGA |
Plastic Pin Grid Array Package
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POWERSOP2 |
Exceptional performance through the innovative design of PSOPs offer
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PSVFBGA |
Package on Package (PoP) Family
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FCBGA |
Package sizes from 10 mm to 55 mm (60 mm and 65 mm in development)
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SO8-FL |
Interconnect - Cu clips technology for better electrical and thermal
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SOD123-FL |
Bare copper leadframe with no plating
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SOD128-FL |
Bare copper leadframe with no plating
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SOD323-FL |
Interconnect - Cu clips technology for better electrical and thermal
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SSOP |
Shrink Small Outline, Quarter-Size Small-Outline Packages
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TSON8-FL |
Bare copper leadframe with no plating
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CERAMIC |
Glass or solder seal up to 435C
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FUSIONQUAD |
Increased I/O (116 to 356) in smaller package footprints
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MICROLEADFRAME |
Saw MLF PEL (Plated End Lead) Package
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POWERSOP |
Power Small Outline Package,PowerSOP
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WLCSP |
Wafer Level Processing and Die Processing Services
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AG-ALLOY |
Silver Wirebonding
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D2PAK |
D2PAK follows the JEDEC standard (TO-263) for high-power discrete products.
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DPAK |
DPAK follows the JEDEC standard for medium-power discrete products.
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DSMBGA |
To continue to improve the integration and robustness of RFFE
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EPADTSSOP |
ExposedPad (ePad) TSSOP, MSOP, SOIC and SSOP are leadframe based
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FCIP |
Demand for flip chip interconnect technology is being driven by a number of factors from all corners of the silicon industry.
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FLIPSTACKCSP |
The FlipStack® CSP family utilizes Amkor’s industry leading ChipArray® Ball Grid Array (CABGA) manufacturing capabilities
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HSON8 |
HSON8 features an exposed die pad to enhance thermal performance.
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IHS |
Si is an effective alternative to Cu as a heat spreader material.
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INTERPOSERPOP |
Interposer Package-on-Package
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LFPAK56-SINGLE |
LFPAK56–SINGLE follows the JEDEC standard (MO-235) for medium-power discrete products.
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MEMS |
MEMS are micron-size devices that can sense or manipulate the physical world.
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MLF |
Amkor’s MicroLeadFrame® package is a near CSP plastic encapsulated package with a copper leadframe substrate.
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OPTICALSENSOR |
Optical sensors convert various wavelengths into electrical signals for enhanced sensing applications.
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POP |
Bottom PoP Technologies
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POWERCSP |
PowerCSP™ is an innovative chip scale power transistor package.
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PQFN |
The PQFN is a highly efficient space-saving package designed for a wide range of higher power applications.
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PSMC |
The PSMC package is part of the FLAT series of compact surface mount packages which allow miniaturization.
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CABGA_V01 |
Amkor’s ChipArray® Ball Grid Array (CABGA) laminate based packages are compatible with SMT mounting processes worldwide.
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FCBGA_V01 |
Amkor FCBGA packages are assembled around state‑of‑the‑art, single unit laminate or ceramic substrates.
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LQFP_V01 |
Amkor offers a broad line of LQFP IC packages with a 1.4 mm body thickness.
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MQFP_V01 |
Amkor’s MQFP (Metric Quad Flat Pack) packages allow the flexibility of growing or shrinking IC package size based upon application need.
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PBGA_V01 |
Amkor’s PBGA/TEPBGA packages incorporate the most advanced assembly processes and designs for cost/performance applications.
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FCCSP_V01 |
Amkor Technology offers the Flip Chip CSP (fcCSP) package – a flip chip solution in a CSP package format.
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S-SWIFT |
Substrate-SWIFT (S-SWIFT) technology is revolutionizing the world of advanced packaging.
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SCSP |
The Stacked CSP family leverages Amkor’s industry-leading ChipArray® Ball Grid Array (CABGA) manufacturing capabilities.
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SIP |
SiPs as multi-component, multifunction products in an IC package.
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SO8-FL-V01 |
This package is available in both JEDEC and JEITA package outlines.
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SOD123-FL-V01 |
The SOD123-FL package is part of the FLAT series of compact surface mount packages which allow communication equipment to be miniaturized.
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SOD128-FL-V01 |
The SOD128-FL package is part of the FLAT series of compact surface mount packages which allow communication equipment to be miniaturized.
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SOIC |
SOIC (Small Outline IC Package) is a leadframe based, plastic encapsulated package
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SOT-23 |
SOT-23 (Small Outline Transistor) and TSOT (Thin Small Outline Transistor Package) are leadframe based, plastic encapsulated packages
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SSOP-V01 |
SSOP (Shrink Small-Outline Package) and QSOP (Quarter-Size Small Outline Package) are leadframe based, plastic encapsulated packages
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SWIFT |
Silicon Wafer Integrated Fan-out Technology (SWIFT) is designed to provide increased I/O and circuit density in a reduced footprint and profile for single and multi-die applications.
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TO-220FP |
TO-220FP is a full pack version of TO-220
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TOLL |
TOLL (TO-Leadless) is a highly efficient space-saving package designed for currents up to 300A in automotive applications.
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TQFP |
Amkor offers a broad line of TQFP (Thin Quad Flat Pack) IC packages.
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TSON8-FL-V01 |
TSON8-FL (Flat Lead) is a smaller package (3.3 x 3.3 mm) with thermal enhancments that give a 64% reduction in footprint area compared with standard SOIC 8 ld package
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TSSOP |
TSSOP (Thin Shrink Small Outline Package) and MSOP (Mini Small Outline Package) are leadframe based, plastic encapsulated packages
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TSV |
Through Silicon Via (TSV) interconnects serve a wide range of 2.5D packaging applications and architectures.
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WAFERBUMPING |
Wafer Bumping Processes and Die Level Interconnect Technology Services
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WLCSP-V01 |
Wafer Level Processing & Die Processing Services (WLP/DPS)
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WLFO |
Wafer level packaging applies similar processes as used in front-end wafer processing.
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WLSIP-WL3D |
Embedded Wafer Level System Integration
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