| Manufacturer | Part # | Datasheet | Description |
 GigaDevice Semiconducto... |
GD25S512MDBJS
|
1Mb/87P
|
3.3V Uniform Sector Dual and Quad Serial Flash
|
| Search Partnumber :
Start with "2MDBJS" -
Total : 100 ( 1/5 Page) |
 RMT Ltd. |
2MD04-014-05
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
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2MD04-014-05
|
2Mb/8P |
Blank ceramics (not metallized)
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2MD04-014-08
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2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
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2MD04-014-08
|
2Mb/8P |
Blank ceramics (not metallized)
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2MD04-014-10
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2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
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2MD04-014-10
|
2Mb/8P |
Blank ceramics (not metallized)
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2MD04-014-12
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2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
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2MD04-014-12
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2Mb/8P |
Blank ceramics (not metallized)
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2MD04-014-15
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2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
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2MD04-014-15
|
2Mb/8P |
Blank ceramics (not metallized)
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2MD04-022-05
|
334Kb/4P |
Thermoelectric Module
|
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2MD04-022-05
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
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2MD04-022-05
|
2Mb/8P |
Blank ceramics (not metallized)
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2MD04-022-05-1
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2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
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2MD04-022-05/1
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2Mb/8P |
Blank ceramics (not metallized)
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|
2MD04-022-05
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
|
2MD04-022-08
|
334Kb/4P |
Thermoelectric Module
|
|
2MD04-022-08
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
|
2MD04-022-08
|
2Mb/8P |
Blank ceramics (not metallized)
|