Manufacturer | Part # | Datasheet | Description |
Molex Electronics Ltd. |
0440670201
|
216Kb/3P
|
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140")
|
0440670401
|
216Kb/3P
|
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB
|
0440670402
|
216Kb/3P
|
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB
|
0440670403
|
216Kb/3P
|
3.00mm (.118") Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 4 Circuits, 0.76關m (30關") Gold (Au) Selective Plating
|
0440670601
|
216Kb/3P
|
3.00mm (.118") Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 6 Circuits, Tin (Sn) Plating
|
0440670602
|
216Kb/3P
|
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm
|
0440670603
|
216Kb/3P
|
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140")
|
0440670801
|
216Kb/3P
|
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140")
|
0440670802
|
216Kb/3P
|
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick
|
PHOENIX CONTACT |
1406700
|
49Kb/2P
|
Insulating sleeve, as touch protection, slide onto the conductor before for 2.8 slip-on sleeves
|
TE Connectivity Ltd |
1406702-1
|
259Kb/2P
|
Mini Torque Wrenches
|
Turck, Inc. |
4406701
|
1,023Kb/3P
|
Inductive Sensor
11/07/2023
|
Intersil Corporation |
84067012A
|
103Kb/7P
|
CMOS Octal Latching Bus Driver
March 1997
|
84067012A
|
148Kb/7P
|
CMOS Octal Latching Bus Driver
|
8406701RA
|
103Kb/7P
|
CMOS Octal Latching Bus Driver
March 1997
|
8406701RA
|
148Kb/7P
|
CMOS Octal Latching Bus Driver
|
84067022A
|
105Kb/6P
|
CMOS Octal Latching Inverting Bus Driver
March 1997
|
8406702RA
|
105Kb/6P
|
CMOS Octal Latching Inverting Bus Driver
March 1997
|