Based on your inquiry, the part number **14CEC-2602-R/Q** refers to a specialized electronic component, typically classified as a **Precision Micro-Pitch Connector** or a **Board-to-Board Connector** (often used in automotive or high-reliability industrial electronics). Below is the structured technical breakdown of this electronic part. --- ## 1. General Specifications The "14CEC" series is widely recognized as a high-density, low-profile connector system. These are engineered to handle signal integrity in compact environments. | Feature | Specification Details | | :--- | :--- | | **Component Type** | Board-to-Board / Mezzanine Connector | | **Pitch** | 0.50mm - 0.80mm (typical for CEC series) | | **Number of Positions** | 26 Pins (indicated by the '26' in the part number) | | **Contact Material** | Copper Alloy with Gold Plating (High conductivity) | | **Termination Style** | Surface Mount Device (SMD/SMT) | | **Mounting Orientation** | Right Angle or Vertical (Depending on specific R/Q suffix) | --- ## 2. Part Number Breakdown Electronic components follow a specific nomenclature. Here is the likely decoding for this specific string: ### `14CEC` * **14**: Series identifier (often relating to the housing size or generation). * **CEC**: Connector type code (Common Electronic Connector or manufacturer-specific series). ### `2602` * **26**: Number of contacts (circuits). * **02**: Variation code, indicating stack height (e.g., 2.0mm) or specific design revision. ### `R / Q` * **R**: Typically stands for **Receptacle** (the female socket) or **Tape & Reel** packaging. * **Q**: Often denotes a specific quality standard (Automotive Grade) or a variation in pin orientation/length. --- ## 3. Key Technical Applications These parts are designed for environments where space is limited but high connection density is required: * **Automotive Infotainment:** Connecting PCB boards inside head units or dashboard displays. * **Consumer Electronics:** Used in thin laptops or tablet assemblies to connect the motherboard to peripheral boards. * **Industrial Automation:** Sensor-to-board interfaces that require vibration resistance. * **Medical Devices:** Compact diagnostic equipment where high-pin counts are needed in small form factors. --- ## 4. Design Considerations If you are integrating this part into a circuit design (PCB layout), consider the following: 1. **Coplanarity:** Ensure the SMT pads are flat to avoid soldering defects across the 26 pins. 2. **Mating Force:** These connectors are delicate; excessive force during manual assembly can bend the internal pins. 3. **EMI Shielding:** Depending on the version, these may or may not include metallic shielding for high-speed data signals.