The **2017-23-SMC-RPLF** refers to a high-performance **Surface Mount (SMD) Power Inductor** manufactured by **Delevan** (a subsidiary of API Delevan). This specific series is designed for high-reliability applications, particularly where space is limited and power efficiency is critical. --- ### 1. Technical Specifications The part number follows a specific nomenclature. Here is the breakdown of the technical characteristics for the **2017-23-SMC-RPLF** series: | Parameter | Value / Description | | :--- | :--- | | **Component Type** | Shielded Surface Mount Inductor | | **Inductance Range** | 1.0 µH to 1000 µH (Series dependent) | | **Tolerance** | ±15% (Typical for the -23 variant) | | **Operating Temperature** | -55°C to +125°C | | **Core Material** | Ferrite | | **Shielding** | Magnetically Shielded (Low EMI) | | **Termination** | RoHS Lead-Free (indicated by **LF**) | --- ### 2. Part Number Breakdown Understanding the suffix and prefix codes helps in identifying the exact variant: * **2017:** Indicates the physical size/package style (Dimensions approx. 5.3mm x 5.3mm x 4.5mm). * **-23:** The specific dash number representing the **inductance value** and **DC resistance (DCR)**. * **SMC:** Indicates a Surface Mount Chip configuration with a shielded construction. * **RP:** Refers to the "Reliability Plus" or high-performance testing standards. * **LF:** Lead-Free / RoHS Compliant. --- ### 3. Key Features and Applications The 2017 series is engineered for durability and electrical stability. #### Features * **Magnetic Shielding:** Minimizes electromagnetic interference (EMI) with surrounding components. * **High Current Handling:** Designed to maintain inductance levels even under significant current loads. * **Robust Construction:** The "SMC" design provides excellent mechanical stability during PCB vibration or thermal cycling. #### Applications * **DC-DC Converters:** Used in voltage regulation modules for industrial electronics. * **Power Supplies:** Filtering and energy storage in compact switch-mode power supplies (SMPS). * **Handheld Devices:** Due to the small "2017" footprint, it is suitable for portable medical or communication gear. * **Automotive/Aerospace:** Often used in mission-critical sensors where heat and vibration are factors. --- ### 4. Footprint and Soldering The component is intended for automated SMT (Surface Mount Technology) assembly. ```markdown Recommended Pad Layout (Approximate): [ Pad A ] <--- 1.5mm ---> [ Pad B ] Width: 4.0mm ``` ---