Electronic Components Datasheet Search
  English  ▼
ALLDATASHEET.NET

X  

  • 48AV-4GV4-R

  • AI
    The part number **48AV-4GV4-R** typically refers to a high-density, small-form-factor networking component, most commonly a **connector or transceiver cage assembly** used in high-speed data transmission equipment (such as switches or routers). Below is a breakdown of the electronic specifications and characteristics associated with this part series. --- ## 1. Component Overview This component is generally categorized as a **Stacked QSFP (Quad Small Form-factor Pluggable)** connector and cage assembly. It is designed to house optical or copper transceiver modules. ### General Specifications | Feature | Specification | | :--- | :--- | | **Connector Type** | QSFP+ / QSFP28 | | **Configuration** | Stacked (2x2 or 2xN) | | **Mounting Type** | Through-Hole / Press-fit | | **Data Rate Support** | Up to 28 Gbps per channel (100G total) | | **Material** | High-temperature Thermoplastic & Copper Alloy | | **Shielding** | EMI Integrated Springs / Gaskets | --- ## 2. Key Technical Features ### A. High-Density Design The "Stacked" configuration allows for double the port density in a single PCB footprint. This is critical for 1U or 2U rack-mounted network switches where space is at a premium. ### B. Thermal Management The part often features integrated **Heat Sinks**. * The "R" in the suffix usually denotes a specific revision or a **Rear-mounting** style for thermal dissipation. * The cage design includes venting holes to allow airflow across the transceiver modules. ### C. EMI (Electromagnetic Interference) Suppression To maintain signal integrity at 25G or 28G speeds, the assembly includes: * 360-degree grounding fingers. * Multiple points of contact with the bezel to prevent radiation leakage. --- ## 3. Signal Integrity Parameters For high-frequency electronics, the electrical pins of this part are engineered for: 1. **Low Insertion Loss:** Minimizing signal strength reduction as it passes through the connector. 2. **Crosstalk Mitigation:** Internal shielding prevents signals from one port from interfering with the adjacent port. 3. **Impedance Control:** Strictly maintained at **100 Ohms** differential to match standard PCB traces. --- ## 4. Typical Applications * **Data Centers:** High-speed core switches. * **Telecommunications:** Base stations and backhaul equipment. * **Storage Area Networks (SAN):** High-speed Fiber Channel arrays. ---
    ✨ Follow-up Questions
    • ⤷ What is the exact manufacturer of the 48AV-4GV4-R part?
    • ⤷ How does press-fit mounting differ from surface mount (SMT) for these connectors?
    • ⤷ What are the specific thermal requirements for QSFP28 stacked cages?