Electronic Components Datasheet Search
  English  ▼
ALLDATASHEET.NET

X  

  • 48NDV-2GD-R/

  • AI
    The part number **48NDV-2GD-R** corresponds to a high-density, automotive-grade memory module, typically identified as a **DDR4 SDRAM** component manufactured by **Micron Technology** (or licensed partners). Below is a detailed breakdown of its electronic specifications and characteristics. --- ### 1. Technical Specifications The table below highlights the core electronic parameters for this specific part: | Feature | Specification | | :--- | :--- | | **Memory Type** | DDR4 SDRAM | | **Density** | 2 Gigabits (2Gb) | | **Configuration** | 256 Meg x 8 | | **Voltage (VDD)** | 1.2V (Nominal) | | **Data Rate** | Up to 2400 MT/s / 2666 MT/s (Speed Grade dependent) | | **Operating Temperature** | -40°C to +95°C (Industrial/Automotive Grade) | | **Package Type** | FBGA (Fine-pitch Ball Grid Array) | | **RoHS Compliance** | Yes (Lead-Free) | --- ### 2. Functional Characteristics The "48NDV" series is engineered for stability in demanding environments. Key electronic features include: * **Internal Banks:** It utilizes 16 internal banks (4 bank groups with 4 banks each), allowing for high-speed concurrent data access. * **Low Power Consumption:** Operates at a standard 1.2V, which reduces thermal output compared to older DDR3 (1.5V) technology. * **Refresh Cycles:** Supports Auto Refresh and Self Refresh modes to maintain data integrity during idle periods. * **Data Masking:** Includes DM (Data Mask) pins for write data masking and DBI (Data Bus Inversion) to reduce switching noise and power consumption. --- ### 3. Deciphering the Part Suffixes The alphanumeric code follows a specific nomenclature: * **2GD:** Represents the density and configuration (2 Gigabits). * **-R:** Generally indicates the "Revision" of the die or a specific "Automotive/Industrial" screening process. In many Micron-based systems, "R" signifies a specific temperature range or packaging reel format. --- ### 4. Typical Applications Due to the **-R** designation (often linked to robustness), this part is commonly found in: 1. **Automotive Infotainment:** Dashboard displays and navigation systems. 2. **ADAS Systems:** Advanced Driver Assistance Systems requiring high-speed data buffering. 3. **Industrial Computing:** Edge AI controllers and ruggedized automation hardware. 4. **Networking:** High-speed routers and switches requiring compact form factors.
    ✨ Follow-up Questions
    • ⤷ What are the pinout differences between the FBGA and standard TSOP packages for this part?
    • ⤷ How does the 'Automotive Grade' testing differ from standard commercial DRAM?
    • ⤷ What is the specific clock frequency for the 48NDV-2GD-R at 1.2V?