The **ATS-01A-01-C3-R0** is a specific electronic component primarily classified as a **High-Performance Heat Sink**. It is manufactured by Advanced Thermal Solutions (ATS) as part of their "blueICE" series, designed for cooling electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-01A-01-C3-R0 | | **Product Category** | Passive Cooling / Heat Sink | | **Material** | Aluminum (High Thermal Conductivity) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | Variable based on Airflow (Low-pressure drop design) | --- ### 2. Physical Dimensions Precision measurements are critical for PCB layout integration: * **Length:** 40.00 mm * **Width:** 40.00 mm * **Height:** 6.00 mm (Low Profile) * **Fin Style:** Straight Fin (optimized for unidirectional airflow) --- ### 3. Key Electronic Cooling Concepts The "C3" and "R0" suffixes in the part number refer to specific manufacturing and compliance standards: 1. **Material Design:** The aluminum construction ensures rapid heat dissipation away from the semiconductor die. 2. **Thermal Interface Material (TIM):** These units often come with pre-applied phase-change material or high-performance thermal tape to reduce thermal impedance between the component and the heat sink. 3. **PushPIN™ Technology:** This part utilizes a specialized attachment mechanism consisting of a plastic or brass pin and a spring. This ensures even pressure across the electronic chip, preventing mechanical stress while maintaining optimal thermal contact. --- ### 4. Typical Applications * **Embedded Systems:** Ideal for space-constrained industrial computers. * **Telecommunications:** Used on high-speed data processing chips. * **Power Electronics:** Cooling MOSFETs or Voltage Regulators in power supply units. ---