The part number **ATS-01A-07-C1-R0** refers to a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push pin" heat sink series, designed for cooling electronic components like CPUs, GPUs, and FPGAs. --- ## Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Heat Sink Type** | Board Level (Push Pin) | | **Attachment Method** | Push Pin (Plastic or Brass) | | **Fin Style** | Straight Fin | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | ~17.00°C/W (at 200 LFM) | | **Dimensions** | 45mm x 45mm x 6mm | --- ## Component Breakdown ### 1. Thermal Design The **ATS-01A-07-C1-R0** is a low-profile heat sink. Its "Straight Fin" geometry is optimized for **forced air convection** (where a fan is present). The blue anodized finish is not just for aesthetics; it increases surface emissivity, which helps in radiating heat away from the component. ### 2. Mounting Mechanism: Push Pins Unlike adhesive-based heat sinks, this model uses a mechanical **Push Pin and Spring** system: * **Stability:** Provides consistent pressure (Pre-assembled) across the interface for better thermal transfer. * **Reliability:** Mechanical mounting is less likely to fail over time compared to thermal tape in high-vibration environments. * **Standard Spacing:** Requires specific holes in the PCB to lock the pins in place. ### 3. Thermal Interface Material (TIM) The "R0" at the end of the part number typically indicates that it comes with a **pre-applied thermal interface material**. This ensures that the microscopic gaps between the heat sink and the chip are filled, reducing thermal resistance immediately upon installation. --- ## Use Cases * **Network Switches:** Cooling packet processors. * **Industrial PCs:** Maintaining stability in compact enclosures. * **Power Supplies:** Heat dissipation for MOSFETs or voltage regulators. ---