The **ATS-01A-07-C3-R0** is a high-performance thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 45mm x 45mm x 10mm | | **Thermal Resistance** | 17.09 °C/W (at 100 LFM) | | **Airflow Path** | Straight Fin | --- ### 2. Key Electronic & Mechanical Components #### A. The Heat Sink Body (Straight Fin) The body is made of **Aluminum 6063**, chosen for its excellent thermal conductivity and lightweight properties. The "Straight Fin" design is optimized for environments where there is a consistent, directional airflow (forced convection). #### B. pushPIN™ Attachment Mechanism Unlike adhesive-based heat sinks, this model uses a mechanical fastening system: * **Push Pins:** Made of durable brass or plastic. * **Springs:** Provide "firm attachment" and consistent pressure (Pre-assembled) to ensure maximum contact between the component and the heat sink. #### C. Thermal Interface Material (TIM) The "R0" suffix typically indicates that the part comes with a **pre-applied Thermal Interface Material**. This is a layer of conductive paste or pad that fills microscopic air gaps between the heat sink and the electronic chip, significantly reducing thermal resistance. --- ### 3. Thermal Performance Analysis The performance of this part is highly dependent on the velocity of the air moving through the fins, measured in Linear Feet per Minute (LFM). | Air Velocity | Thermal Resistance (°C/W) | | :--- | :--- | | **100 LFM (0.5 m/s)** | 17.09 | | **300 LFM (1.5 m/s)** | 6.22 | | **500 LFM (2.5 m/s)** | 4.32 | --- ### 4. Typical Applications * **Embedded Systems:** Cooling microprocessors in industrial PCs. * **Telecommunications:** Cooling ASICs in networking switches and routers. * **Power Supplies:** Dissipating heat from MOSFETs or voltage regulators.