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  • ATS-01A-08-C3-R0

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    The **ATS-01A-08-C3-R0** is a specific electronic component categorized as a **High-Performance Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). It is part of their "push pin" attachment series designed for cooling integrated circuits (ICs) and other electronic packages. --- ### ## Technical Specifications Below are the primary technical parameters for this component: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-01A-08-C3-R0 | | **Heat Sink Type** | Push Pin (Spring-loaded) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Fin Style** | Straight (Extruded) | | **Attachment Method** | Push Pin (with plastic/brass options) | | **Thermal Resistance** | Variable based on Airflow (LFM) | --- ### ## Key Features & Design The ATS-01A-08-C3-R0 is engineered for specific thermal management requirements: * **Push Pin Attachment:** This part uses a spring-loaded push pin mechanism. This provides a consistent, high-pressure contact between the heat sink and the electronic component, which improves thermal transfer efficiency. * **Material Science:** Constructed from 6063 aluminum, providing a lightweight yet thermally conductive base. The blue anodized finish increases surface emissivity and provides corrosion resistance. * **Pre-Applied Interface:** Most parts in this series come with **Phase Change Material (PCM)** or high-performance thermal tape pre-applied to the base to eliminate the need for manual thermal paste application. ### ## Application Context This component is typically found in: 1. **Networking Hardware:** Switches, routers, and high-speed modems. 2. **Embedded Computing:** Cooling for SoCs (System on Chips) or FPGAs. 3. **Power Electronics:** Voltage regulators or power modules that generate localized heat. --- ### ## Thermal Performance Thermal resistance $(\theta_{ja})$ is dependent on the airflow velocity across the fins: | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Static/Natural) | ~14.0 - 15.0 | | 300 (Forced Air) | ~6.0 - 8.0 | | 500 (High Velocity) | ~4.5 - 5.5 | *(Note: These values are typical estimates for the 08-series dimensions; actual performance varies by board layout.)*
    ✨ Follow-up Questions
    • ⤷ What are the physical dimensions (LxWxH) of the ATS-01A-08-C3-R0?
    • ⤷ What hole pattern is required on the PCB to accommodate these push pins?
    • ⤷ Does this model come with a specific thermal interface material (TIM) pre-applied?