The **ATS-01A-101-C3-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is specifically designed for cooling electronic components like CPUs, GPUs, and other integrated circuits that require efficient thermal management. --- ### 1. Technical Specifications The following table highlights the core physical and thermal properties of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 30.00mm | | **Thermal Resistance (Flowing)** | 1.20 °C/W (@ 100 LFM) | | **Thermal Resistance (Static)** | 6.70 °C/W | | **Pitch** | Fine Pitch | --- ### 2. Key Electronic & Mechanical Components #### A. The Heat Sink Body The body is constructed from aluminum for its high thermal conductivity-to-weight ratio. The **"C3"** in the part number indicates a specific thermal performance grade and material composition (typically high-grade aluminum). #### B. pushPIN™ Attachment System This part uses a specialized mechanical attachment system instead of simple adhesive. - **Springs:** Ensures consistent pressure between the heat sink and the electronic chip to minimize air gaps. - **Hardware:** Usually brass or steel pins that lock into the PCB (Printed Circuit Board) holes. #### C. Thermal Interface Material (TIM) The **"R0"** suffix typically denotes that the heat sink comes with a pre-applied thermal interface material (like thermal grease or a pad). This fills microscopic valleys between the electronic part and the metal surface to improve heat transfer. --- ### 3. Application Usage In an electronic circuit, this part is used to prevent **thermal throttling** or component failure. It is commonly found in: * **Networking Equipment:** Routers and switches. * **Power Supplies:** High-voltage regulators. * **Industrial PCs:** Compact systems where airflow is directed through fine-pitch fins.