The **ATS-01A-102-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **blueICE™** series and is specifically designed for cooling electronic components such as BGAs (Ball Grid Arrays) and other surface-mount packages. --- ## 1. Technical Specifications Below are the key mechanical and thermal characteristics of the part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Dimensions (L x W x H)** | 45mm x 45mm x 25mm | | **Thermal Resistance** | 5.24°C/W @ 200 LFM | | **Flow Orientation** | Omni-directional (Pin Fin) | | **Spring Type** | Compression Spring | --- ## 2. Key Electronic & Physical Features ### A. Pin Fin Design Unlike traditional straight-fin heat sinks, the ATS-01A-102-C2-R0 uses a **Pin Fin** array. - **Benefit:** This allows for omni-directional airflow, meaning the cooling efficiency remains high regardless of which direction the air enters the sink. It is ideal for crowded PCBs where airflow patterns are unpredictable. ### B. Push-Pin Attachment The component utilizes a plastic push-pin mechanism with a built-in spring. - **Reliability:** This provides a consistent pressure (Preload) on the electronic component (CPU, GPU, or ASIC), ensuring optimal contact with the Thermal Interface Material (TIM). - **PCB Mounting:** It requires pre-drilled holes in the PCB. ### C. Material Properties - **Aluminum 6063:** Provides a lightweight solution with high thermal conductivity. - **Blue Anodization:** In addition to the aesthetic "Blue" look, the anodized coating provides moderate electrical insulation and increased corrosion resistance. --- ## 3. Applications This part is commonly found in the following electronic systems: * **Telecommunications:** Network switches and routers. * **Embedded Systems:** Industrial PCs and high-speed controllers. * **Power Electronics:** Cooling for large MOSFET arrays or high-performance voltage regulators. --- ## 4. Thermal Performance Data *Measured at different airflow velocities (Linear Feet per Minute):* | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 200 | 1.0 | 5.24 | | 400 | 2.0 | 3.23 | | 600 | 3.0 | 2.51 | ---