The **ATS-01A-12-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "superGRIP" series, designed specifically for cooling electronic components such as BGA (Ball Grid Array) chips, FPGAs, and processors. --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (High Thermal Conductivity) | | **Finish** | Blue Anodized | | **Thermal Resistance** | 15.80°C/W (Natural Convection) | | **Mounting Type** | superGRIP Clip (Tool-less) | | **Dimensions** | 30mm x 30mm x 7.5mm | | **Attachment Method** | Mechanical Clip + Thermal Interface Material (TIM) | --- ### 2. Physical Design and Construction * **Fin Geometry:** It features a **Straight-Fin** design. This is optimized for airflow in one direction and is highly efficient in forced-air environments (using fans). * **Low Profile:** With a height of only **7.5mm**, this part is ideal for low-clearance applications such as 1U servers, embedded systems, or thin networking gear. * **Material Choice:** Aluminum is used to provide a balance between lightweight construction and high thermal dissipation capabilities. --- ### 3. The "superGRIP" Mounting System The most notable "electronic part" aspect of this assembly is the **superGRIP** mechanical attachment. 1. **Frame Clip:** A plastic frame snaps around the base of the component (e.g., the FPGA or CPU). 2. **Spring Clip:** A metal spring clip (typically stainless steel) applies consistent pressure across the heat sink. 3. **No Holes Required:** Unlike traditional heat sinks that require holes drilled into the PCB, this clips directly to the chip, saving board space for trace routing. --- ### 4. Thermal Performance Thermal resistance values vary based on the airflow speed (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 200 | 1.0 | 7.5 | | 400 | 2.0 | 5.3 | | 600 | 3.0 | 4.3 | --- ### 5. Part Number Breakdown * **ATS:** Advanced Thermal Solutions (Manufacturer). * **01A:** Series designation. * **12:** Specific sizing code for the 30mm footprint. * **C2:** Indicates the thermal interface material or specific finish (Blue Anodized). * **R0:** Revision code (Standard RoHS compliant version).