The part number **ATS-01A-121-C2-R0** refers to a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push pin" heat sink series designed for cooling electronic components like CPUs, GPUs, and FPGAs. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Dimensions (L x W x H)** | 45mm x 45mm x 30mm | | **Thermal Resistance** | 9.48°C/W (Unducted Flow @ 200 LFM) | | **Fin Style** | Straight Fin | | **Base Type** | Flat | --- ### 2. Breakdown of Part Number Nomenclature Advanced Thermal Solutions uses a specific coding system to define their parts: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **01A**: Part series/family (Standard push-pin assembly). * **121**: Specific geometry and fin configuration. * **C2**: Refers to the thermal interface material (TIM) and finish. "C2" typically indicates a **Blue Anodized** finish with a specific pre-applied thermal pad/tape. * **R0**: Revision or RoHS compliance status. --- ### 3. Key Electronic Functions While a heat sink is a passive mechanical component, it is critical to electronic system stability: 1. **Thermal Dissipation**: It increases the surface area of the component it is mounted on, allowing heat to transfer more efficiently into the surrounding air. 2. **Thermal Interface Material (TIM)**: This part comes with a pre-applied TIM on the base, which fills microscopic air gaps between the heat sink and the electronic chip to improve conductivity. 3. **Mechanical Attachment**: The push-pin mechanism uses a spring-loaded design to provide consistent pressure on the chip, ensuring optimal thermal contact without over-tightening. --- ### 4. Common Applications * **Integrated Circuits (ICs)**: Cooling high-speed processors or chipsets. * **Power Electronics**: Managing heat in voltage regulators or power modules. * **Embedded Systems**: Used in industrial PCs or networking equipment where airflow is managed.