The **ATS-01A-141-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "Blue Anodized" series designed for component-level cooling, specifically for electronic chips like CPUs, GPUs, or high-power ASICs. --- ### 1. Technical Specifications The following table summarizes the physical and thermal characteristics of this specific part: | Parameter | Specification | | :--- | :--- | | **Product Series** | pushPIN™ | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 25mm x 25mm x 10mm | | **Attachment Method** | Push Pin (Plastic) | | **Spring Type** | Compression Spring | | **Thermal Resistance (Unducted)** | 15.76 °C/W @ 100 LFM | | **Thermal Resistance (Ducted)** | 7.30 °C/W | --- ### 2. Key Component Features #### A. Fin Design This heat sink uses a **straight-fin** geometry. Straight fins are optimized for unidirectional airflow. The 10mm height makes it a "low-profile" solution, ideal for compact server racks or thin electronic enclosures where vertical space is limited. #### B. Attachment Mechanism: pushPIN™ Instead of using messy thermal adhesives or tapes, the **-R0** suffix indicates a push-pin attachment system. - **The Pin:** Usually made of durable plastic or brass. - **The Spring:** Provides consistent pressure (Pre-assembled) across the interface, ensuring better thermal contact between the chip and the heat sink. #### C. Thermal Interface Material (TIM) Typically, these units come with a pre-applied **T766** thermal phase-change material or a high-performance thermal pad on the base. This eliminates the need for manual application of thermal paste during assembly. --- ### 3. Part Number Breakdown Understanding the nomenclature helps in identifying variants: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **01** | Push Pin Type/Series | | **141** | Specific Dimension/Fin Configuration | | **C2** | Performance class / Material grade | | **R0** | RoHS Compliant / Revision status | --- ### 4. Typical Applications * **Networking:** Routers, switches, and high-speed modems. * **Industrial PC:** Small form factor (SFF) boards. * **Embedded Systems:** FPGA or microcontrollers generating moderate heat (5W–15W range).