The part number **ATS-01A-151-C1-R0** refers to a high-performance **Heatsink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push pin" series designed for cooling electronic components like CPUs, GPUs, and power modules. --- ### 1. Technical Specifications The table below summarizes the core physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Plastic) / Spring | | **Dimensions (L x W x H)** | 35mm x 35mm x 10mm | | **Thermal Resistance** | 16.30°C/W (Unducted Flow @ 200 LFM) | | **Number of Fins** | Fine Pitch (Straight Fin) | --- ### 2. Breakdown of Part Number Nomenclature Understanding the suffix codes helps identify the specific variant of this thermal solution: * **ATS-01A**: Part of the standard ATS series (01A indicates the specific push-pin design family). * **151**: Unique model identifier (correlates to the 35mm x 35mm x 10mm sizing). * **C1**: Refers to the **Thermal Interface Material (TIM)**. C1 usually indicates a pre-applied phase-change material or high-performance thermal pad (e.g., T766). * **R0**: Revision code or packaging indicator. --- ### 3. Key Electronic Functions While the heatsink itself is a passive mechanical part, its role in an electronic system is critical for: 1. **Heat Dissipation:** It increases the surface area of the heat-generating component (e.g., a BGA chip), allowing ambient air to carry heat away more efficiently. 2. **Reliability:** By maintaining a lower junction temperature ($T_j$), it prevents thermal throttling and extends the lifespan of semiconductors. 3. **Mechanical Stability:** The "Push Pin" attachment ensures constant pressure between the heatsink and the chip, which is vital for the thermal interface material to function correctly. --- ### 4. Implementation Details The **Blue Anodized** finish is not just for aesthetics; it provides a layer of protection against corrosion and slightly improves radiant heat transfer compared to raw aluminum. This specific model (10mm height) is considered "Low Profile," making it ideal for compact PCB layouts where vertical space is limited.