The **ATS-01A-153-C2-R0** is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push-pin" series designed for cooling electronic components like CPUs, GPUs, and other high-power ICs. --- ### 1. Technical Specifications The following table highlights the physical and thermal properties of this specific part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Al) | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 40mm x 40mm x 20mm | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 4.05°C/W @ 200 LFM | | **Airflow Direction** | Vertical/Straight Fin | | **TIM (Interface Material)** | T766 (High Performance) | --- ### 2. Key Component Details #### A. The Heat Sink Body The unit uses a **Straight Fin** design. This is optimized for systems with defined airflow (forced air cooling). The 20mm height provides a large surface area for heat dissipation without occupying excessive vertical space in a rack-mounted or compact chassis. #### B. The Attachment Mechanism (Push-Pin) Instead of adhesive tapes, this model uses a **spring-loaded push-pin** system. - **Reliability:** Provides consistent pressure on the chip, ensuring better thermal contact. - **Ease of Use:** Allows for tool-free installation and removal. - **Safety:** Prevents the heat sink from shifting or falling off during high-vibration environments. #### C. Thermal Interface Material (TIM) The part comes pre-applied with **ATS T766**. This is a thermal grease/pad layer that fills microscopic air gaps between the component and the heat sink, significantly reducing thermal resistance compared to dry contact. #### D. Material & Coating - **Aluminum:** Chosen for its excellent thermal conductivity-to-weight ratio. - **Blue Anodization:** Not just for aesthetics; it provides surface protection against corrosion and slightly improves heat radiation (emissivity). --- ### 3. Application Use Cases This part is typically found in: * **Networking Gear:** Switches and Routers. * **Industrial PC Motherboards:** Cooling Northbridge or Southbridge chipsets. * **Power Supplies:** Heat dissipation for MOSFETs or Voltage Regulators. ---