The **ATS-01A-166-C3-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **pushPIN™** series, designed specifically for thermal management in electronic systems. ### Technical Specifications Below are the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Thermal Resistance** | 12.30°C/W (Unducted @ 100 LFM) | | **Attachment Method** | pushPIN™ (Brass Springs) | | **Dimensions (L x W x H)** | 25.00mm x 25.00mm x 15.00mm | | **Pitch** | 1.10mm (approx.) | | **Fin Pattern** | Straight Fin | --- ### Component Breakdown #### 1. Thermal Performance The efficiency of the heat sink is measured by its **Thermal Resistance**. At low airflow (100 LFM), it provides a resistance of 12.30°C/W, which drops significantly to **3.91°C/W** under high airflow (700 LFM). This makes it suitable for high-density PCB environments. #### 2. Attachment Mechanism (pushPIN™) Instead of using messy thermal adhesives or tape, this part uses a mechanical **pushPIN™** system: * **Springs:** Pre-assembled brass springs provide consistent pressure. * **Attachment:** Ensures a secure fit and optimal thermal interface material (TIM) contact. * **TIM:** Usually comes pre-applied with a high-performance thermal interface to simplify assembly. #### 3. Material and Coating * **Aluminum 6063:** Chosen for its excellent thermal conductivity and lightweight properties. * **Blue Anodized Finish:** Provides corrosion resistance and slightly improves heat radiation through emissivity. ### Applications * **Integrated Circuits (ICs):** Cooling microprocessors, FPGAs, or ASICs. * **Telecom Hardware:** Networking switches and routers. * **Embedded Systems:** Industrial PCs where vertical space (15mm) is available. ---