ATS-01A-173-C2-R0
AI

The **ATS-01A-173-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **pushPIN™** series, designed to provide efficient cooling for electronic components like CPUs, GPUs, and power modules.
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### ## Technical Specifications
| Property | Value |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Type** | pushPIN™ |
| **Heat Sink Type** | Push-pin Heat Sink Assembly |
| **Thermal Resistance** | 4.72 °C/W (at 100 LFM) |
| **Dimensions (L x W x H)** | 30.00 mm x 30.00 mm x 30.00 mm |
| **Mounting Pitch** | 35.00 mm |
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### ### Key Electronic Components & Features
The design of the ATS-01A-173-C2-R0 focuses on several critical engineering aspects:
1. **Thermal Interface Material (TIM):**
This specific part usually comes with **T766** pre-applied. This is a high-performance thermal grease that fills microscopic air gaps between the component (heat source) and the heat sink base to maximize heat transfer.
2. **Fin Profile:**
The part uses a **Straight Fin** design. This allows for optimal airflow in a single direction, making it ideal for systems with a dedicated exhaust or intake fan.
3. **Attachment Mechanism:**
It utilizes the **pushPIN™** system, which consists of:
* **Springs:** Provides a consistent pressure (compression) to ensure the heat sink remains in contact with the electronic chip despite vibrations or thermal expansion.
* **Pins:** Usually made of brass or plastic, these lock into pre-drilled holes on the PCB (Printed Circuit Board).
4. **Material Conductivity:**
Made from **6063 Aluminum**, which offers a high thermal conductivity-to-weight ratio, ensuring that heat is drawn away from the sensitive silicon die rapidly.
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### ### Performance Analysis (Thermal Resistance)
Thermal resistance measures how effectively the part moves heat away. Lower values are better.
| Airflow Velocity (LFM) | 100 | 200 | 300 | 400 | 500 |
| :--- | :--- | :--- | :--- | :--- | :--- |
| **Resistance (°C/W)** | 4.72 | 2.95 | 2.41 | 2.12 | 1.92 |
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- ⤷
How do I calculate the required mounting hole diameter for the pushPIN system?
- ⤷ What is the difference between the C2 and C1 versions of this heat sink?
- ⤷ Can this heat sink be used with a custom thermal pad instead of the pre-applied TIM?