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  • ATS-01A-173-C2-R0

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    The **ATS-01A-173-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **pushPIN™** series, designed to provide efficient cooling for electronic components like CPUs, GPUs, and power modules. --- ### ## Technical Specifications | Property | Value | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Type** | pushPIN™ | | **Heat Sink Type** | Push-pin Heat Sink Assembly | | **Thermal Resistance** | 4.72 °C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 30.00 mm x 30.00 mm x 30.00 mm | | **Mounting Pitch** | 35.00 mm | --- ### ### Key Electronic Components & Features The design of the ATS-01A-173-C2-R0 focuses on several critical engineering aspects: 1. **Thermal Interface Material (TIM):** This specific part usually comes with **T766** pre-applied. This is a high-performance thermal grease that fills microscopic air gaps between the component (heat source) and the heat sink base to maximize heat transfer. 2. **Fin Profile:** The part uses a **Straight Fin** design. This allows for optimal airflow in a single direction, making it ideal for systems with a dedicated exhaust or intake fan. 3. **Attachment Mechanism:** It utilizes the **pushPIN™** system, which consists of: * **Springs:** Provides a consistent pressure (compression) to ensure the heat sink remains in contact with the electronic chip despite vibrations or thermal expansion. * **Pins:** Usually made of brass or plastic, these lock into pre-drilled holes on the PCB (Printed Circuit Board). 4. **Material Conductivity:** Made from **6063 Aluminum**, which offers a high thermal conductivity-to-weight ratio, ensuring that heat is drawn away from the sensitive silicon die rapidly. --- ### ### Performance Analysis (Thermal Resistance) Thermal resistance measures how effectively the part moves heat away. Lower values are better. | Airflow Velocity (LFM) | 100 | 200 | 300 | 400 | 500 | | :--- | :--- | :--- | :--- | :--- | :--- | | **Resistance (°C/W)** | 4.72 | 2.95 | 2.41 | 2.12 | 1.92 | ---
    ✨ Follow-up Questions
    • ⤷ How do I calculate the required mounting hole diameter for the pushPIN system?
    • ⤷ What is the difference between the C2 and C1 versions of this heat sink?
    • ⤷ Can this heat sink be used with a custom thermal pad instead of the pre-applied TIM?