The **ATS-01A-18-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heat sink**. It is designed for cooling electronic components such as CPUs, GPUs, or high-power transistors on a PCB. --- ### 1. Component Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Heat Sink Type** | Push-Pin (Spring-loaded) | | **Material** | Aluminum (Blue Anodized) | | **Dimensions** | 35mm x 35mm x 15mm | | **Fin Style** | Straight Fin | | **Attachment Type** | Push-Pin (Brass or Plastic) with Compression Spring | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Electronic & Mechanical Features #### A. Thermal Performance This component is measured by its **Thermal Resistance ($\theta_{ca}$)**, which indicates how many degrees Celsius the temperature rises per watt of power dissipated ($^\circ C/W$). * **Low Airflow:** Higher resistance (less efficient). * **High Airflow:** Lower resistance (optimized for forced convection). #### B. Attachment Mechanism (Push-Pin) Unlike adhesive-based heat sinks, the **Push-Pin** design uses pre-drilled holes in the PCB. * **Uniform Pressure:** The spring ensures constant contact pressure between the heat sink and the electronic chip. * **Reliability:** It is more resistant to shock and vibration compared to tape-on heat sinks. #### C. Material and Coating * **Aluminum 6063:** Provides high thermal conductivity while remaining lightweight. * **Blue Anodized Finish:** Increases surface emissivity and provides electrical insulation/corrosion resistance. --- ### 3. Application Use Cases This specific model is commonly found in: 1. **Telecommunications:** Cooling ASICs in routers and switches. 2. **Embedded Systems:** Industrial PCs where high-vibration environments require secure mechanical fastening. 3. **Power Electronics:** Dissipating heat from high-speed FPGA or memory controllers. --- ### 4. Technical Summary Table | Parameter | Details | | :--- | :--- | | **Flow Direction** | Vertical / Horizontal (Omni-directional compatible) | | **Pressure Drop** | Dependent on CFM (Cubic Feet per Minute) | | **RoHS Status** | Compliant | | **Mounting Hole Pattern** | Standardized for 35mm footprints |