The **ATS-01A-183-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **maxiFLOW™** series, specifically designed for cooling electronic components like processors, FPGAs, and ASICs where airflow is directional. --- ### 1. Technical Specifications The following table summarizes the key physical and thermal properties of this component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 40mm x 40mm x 20mm | | **Thermal Resistance** | 5.37°C/W (Unducted Flow @ 200 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Electronic/Thermal Performance The efficiency of a heat sink is measured by its ability to dissipate heat into the surrounding air. For the ATS-01A-183-C2-R0, performance varies based on air velocity: * **Low Airflow (200 LFM):** 5.37 °C/W * **High Airflow (700 LFM):** 2.20 °C/W As the linear feet per minute (LFM) of the cooling fan increases, the thermal resistance drops significantly, allowing the electronic component to stay within its safe operating temperature (Tj). --- ### 3. Key Design Features #### A. Pin Fin Geometry (maxiFLOW™) Unlike standard straight-fin heat sinks, the maxiFLOW design uses a tapered fin structure. This increases the surface area and creates turbulence in the airflow, which helps break up the boundary layer of air and improves heat transfer. #### B. pushPIN™ Attachment This model uses a **pushPIN™** system which consists of: * **Plastic/Brass Pins:** To secure the sink to the PCB. * **Compression Springs:** To ensure uniform pressure across the component surface, maximizing the effectiveness of the Thermal Interface Material (TIM). #### C. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied. This is a phase-change or high-conductivity material that fills microscopic air gaps between the heat sink and the electronic chip, reducing the contact resistance. --- ### 4. Typical Applications * **Computing:** High-speed microprocessors and memory modules. * **Telecommunications:** Network switches and routers. * **Power Electronics:** Voltage regulators and power MOSFETs.