ATS-01A-26-C2-R0
AI

The **ATS-01A-26-C2-R0** is a specific electronic component categorized as a **High-Performance Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). It belongs to the **pushPIN™** line, designed for efficient thermal management of electronic components like CPUs, GPUs, and high-power chipsets.
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## 1. Technical Specifications
The following table outlines the physical and thermal characteristics of the ATS-01A-26-C2-R0:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Fin Pattern** | Straight / Square-Cut |
| **Attachment Type** | pushPIN™ (Spring-loaded) |
| **Dimensions (LxWxH)** | 70mm x 70mm x 10mm |
| **Thermal Resistance** | 14.20 °C/W (at 100 LFM) |
| **Flow Direction** | Vertical / Horizontal |
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## 2. Key Components & Design
### Mechanical Attachment: pushPIN™
This part utilizes the **pushPIN™** attachment mechanism. This consists of:
- **Push Pins:** Usually made of brass or plastic, designed to lock into pre-drilled holes on a PCB.
- **Compression Springs:** Provides consistent pressure (Force) on the component to ensure optimal thermal contact.
### Material Science
The use of **Aluminum 6063** provides a balance between high thermal conductivity and structural integrity. The **Blue Anodized** finish is not just aesthetic; it provides:
1. **Corrosion Resistance:** Protects the metal from oxidation.
2. **Increased Emissivity:** Improves heat radiation performance.
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## 3. Thermal Performance Profile
Thermal resistance measures how effectively the part moves heat away from the silicon. Performance varies based on airflow (measured in Linear Feet per Minute - LFM):
| Airflow Velocity | Thermal Resistance (Unducted) |
| :--- | :--- |
| **100 LFM (0.5 m/s)** | 14.20 °C/W |
| **300 LFM (1.5 m/s)** | 4.65 °C/W |
| **500 LFM (2.5 m/s)** | 2.53 °C/W |
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## 4. Application Use-Case
The low profile (10mm height) makes this part ideal for:
- **1U Rackmount Servers:** Where vertical clearance is extremely limited.
- **Embedded Systems:** Compact industrial computers.
- **Network Switches:** Cooling high-speed ASICs in thin enclosures.
- ⤷
What are the specific PCB hole patterns required for the pushPIN attachment?
- ⤷ How does 'Ducted' thermal resistance differ from 'Unducted' for this model?
- ⤷ What is the recommended Thermal Interface Material (TIM) for use with this heat sink?