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  • ATS-01A-26-C2-R0

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    The **ATS-01A-26-C2-R0** is a specific electronic component categorized as a **High-Performance Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). It belongs to the **pushPIN™** line, designed for efficient thermal management of electronic components like CPUs, GPUs, and high-power chipsets. --- ## 1. Technical Specifications The following table outlines the physical and thermal characteristics of the ATS-01A-26-C2-R0: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Fin Pattern** | Straight / Square-Cut | | **Attachment Type** | pushPIN™ (Spring-loaded) | | **Dimensions (LxWxH)** | 70mm x 70mm x 10mm | | **Thermal Resistance** | 14.20 °C/W (at 100 LFM) | | **Flow Direction** | Vertical / Horizontal | --- ## 2. Key Components & Design ### Mechanical Attachment: pushPIN™ This part utilizes the **pushPIN™** attachment mechanism. This consists of: - **Push Pins:** Usually made of brass or plastic, designed to lock into pre-drilled holes on a PCB. - **Compression Springs:** Provides consistent pressure (Force) on the component to ensure optimal thermal contact. ### Material Science The use of **Aluminum 6063** provides a balance between high thermal conductivity and structural integrity. The **Blue Anodized** finish is not just aesthetic; it provides: 1. **Corrosion Resistance:** Protects the metal from oxidation. 2. **Increased Emissivity:** Improves heat radiation performance. --- ## 3. Thermal Performance Profile Thermal resistance measures how effectively the part moves heat away from the silicon. Performance varies based on airflow (measured in Linear Feet per Minute - LFM): | Airflow Velocity | Thermal Resistance (Unducted) | | :--- | :--- | | **100 LFM (0.5 m/s)** | 14.20 °C/W | | **300 LFM (1.5 m/s)** | 4.65 °C/W | | **500 LFM (2.5 m/s)** | 2.53 °C/W | --- ## 4. Application Use-Case The low profile (10mm height) makes this part ideal for: - **1U Rackmount Servers:** Where vertical clearance is extremely limited. - **Embedded Systems:** Compact industrial computers. - **Network Switches:** Cooling high-speed ASICs in thin enclosures.
    ✨ Follow-up Questions
    • ⤷ What are the specific PCB hole patterns required for the pushPIN attachment?
    • ⤷ How does 'Ducted' thermal resistance differ from 'Unducted' for this model?
    • ⤷ What is the recommended Thermal Interface Material (TIM) for use with this heat sink?