The **ATS-01A-33-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" series, designed for efficient heat dissipation in compact electronic systems. --- ### 1. Technical Specifications Below are the primary mechanical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized Finish) | | **Dimensions** | 35.00mm x 35.00mm x 20.00mm | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 17.60°C/W (Unducted Flow @ 100 LFM) | | **Fin Style** | Straight | | **Weight** | ~40 grams | --- ### 2. Component Design & Electronic Function While a heat sink is a passive component, its design is critical for the reliability of active electronics (like CPUs, FPGAs, or Power MOSFETs). * **Thermal Interface Material (TIM):** This part typically comes pre-applied with high-performance thermal grease or a phase-change material to ensure minimal thermal resistance between the semiconductor package and the aluminum base. * **Push-Pin Mechanism:** The "01A" designation refers to the specific attachment hardware. It uses a brass or plastic pin with a stainless steel spring. This provides **consistent pressure** across the electronic chip, which is vital for preventing hotspots. * **Aero-Performance:** The straight-fin design is optimized for environments where there is a consistent directional airflow (forced convection), allowing heat to be carried away from the component junction. --- ### 3. Applications The ATS-01A-33-C3-R0 is commonly found in the following electronic sectors: 1. **Telecommunications:** Cooling of high-speed processing chips in routers and switches. 2. **Embedded Systems:** Used on SoCs (System on Chips) that operate in constrained spaces. 3. **Power Electronics:** Managing heat for voltage regulators and power converters. --- ### 4. Part Number Breakdown (Nomenclature) * **ATS:** Manufacturer (Advanced Thermal Solutions). * **01:** Attachment Type (pushPIN™). * **A:** Hardware Material/Style. * **33:** Specific dimensions/footprint code. * **C3:** Thermal performance/Fin height characteristic. * **R0:** RoHS compliant (environmental standard).