The **ATS-01A-34-C2-R0** is a specific electronic cooling component manufactured by **Advanced Thermal Solutions (ATS)**. It is a high-performance heat sink designed primarily for cooling integrated circuits (ICs) and other electronic surface-mount components. ### 1. Key Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-01A-34-C2-R0 | | **Heat Sink Type** | Board Level (Passive) | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Thermal Resistance** | 6.73°C/W (at 200 LFM) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Footprint/Size** | 35mm x 35mm | | **Height** | 25mm | --- ### 2. Design and Construction Features * **Heat Sink Material:** It is made from **Aluminum 6063**, which provides an excellent balance between thermal conductivity and mechanical strength. * **Fin Style:** This model typically utilizes **straight fins** or **cross-cut pins** (depending on the specific sub-series configuration) designed to maximize surface area for convective cooling. * **Thermal Interface Material (TIM):** The "C2" suffix indicates that the part usually comes with a pre-applied high-performance thermal pad or grease (specifically **T766**), ensuring a low-resistance thermal path between the chip and the heat sink. * **Attachment:** The **Push-Pin** mounting system ensures consistent pressure (approx. 20 PSI) on the component, which prevents the heat sink from shifting and optimizes heat transfer. --- ### 3. Thermal Performance (Flow Rate vs. Resistance) The efficiency of this heat sink depends on the airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 6.73 | | 300 (1.5 m/s) | 4.70 | | 400 (2.0 m/s) | 3.80 | | 500 (2.5 m/s) | 3.20 | --- ### 4. Application and Usage This part is commonly found in: 1. **Networking Equipment:** Switches and routers where high-density chips generate significant heat. 2. **Power Supplies:** Cooling voltage regulators or power transistors. 3. **Industrial PCs:** Providing passive cooling for processors or chipsets in compact enclosures.