ATS-01A-35-C2-R0
AI

The **ATS-01A-35-C2-R0** is a specific part number for a high-performance **Heatsink** manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the *push-pin* attachment family of thermal management components.
### 1. Technical Specifications
The following table outlines the mechanical and thermal characteristics of this component:
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Material** | Aluminum (Blue Anodized Finish) |
| **Dimensions** | 35mm x 35mm x 10mm (L x W x H) |
| **Fin Type** | Straight Fin |
| **Attachment Method** | Push-Pin (2-piece assembly) |
| **Thermal Resistance** | ~12.50 °C/W (at 200 LFM) |
| **Thermal Interface** | T766 (Pre-applied Thermal Phase Change Material) |
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### 2. Detailed Electronic & Mechanical Aspects
#### A. Thermal Management (The Heat Dissipation)
As an electronic component, its primary role is to increase the surface area of a heat-generating semiconductor (such as a CPU, FPGA, or GPU).
* **The 35x35mm Footprint:** Designed to cover medium-sized BGA (Ball Grid Array) packages.
* **Thermal Interface Material (TIM):** The "C2" suffix indicates the inclusion of a high-performance phase-change material. This ensures low contact resistance between the chip surface and the aluminum.
#### B. The Push-Pin Attachment Mechanism
Unlike adhesive tapes, the push-pin system provides:
* **Mechanical Pressure:** Ensures consistent contact force for better thermal transfer.
* **Reliability:** Resistant to vibrations, making it suitable for automotive or industrial electronics.
* **Pre-drilled Holes:** Requires the PCB to have specific hole patterns (typically 43mm apart for this series).
#### C. Fin Design
The **Straight Fin** profile is optimized for "forced convection." This means the part performs best when there is an active cooling fan pushing air across the fins.
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### 3. Applications
* **Embedded Computing:** Cooling microcontrollers or small processors on PCBs.
* **Telecommunications:** Cooling chips on network switch line cards.
* **Power Electronics:** Managing heat on power conversion modules.
- ⤷
What is the specific PCB hole pattern required for the push-pin attachment?
- ⤷ How does the T766 thermal material compare to standard thermal grease?
- ⤷ What are the advantages of blue anodized aluminum in electronic cooling?