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  • ATS-01A-35-C2-R0

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    The **ATS-01A-35-C2-R0** is a specific part number for a high-performance **Heatsink** manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the *push-pin* attachment family of thermal management components. ### 1. Technical Specifications The following table outlines the mechanical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Blue Anodized Finish) | | **Dimensions** | 35mm x 35mm x 10mm (L x W x H) | | **Fin Type** | Straight Fin | | **Attachment Method** | Push-Pin (2-piece assembly) | | **Thermal Resistance** | ~12.50 °C/W (at 200 LFM) | | **Thermal Interface** | T766 (Pre-applied Thermal Phase Change Material) | --- ### 2. Detailed Electronic & Mechanical Aspects #### A. Thermal Management (The Heat Dissipation) As an electronic component, its primary role is to increase the surface area of a heat-generating semiconductor (such as a CPU, FPGA, or GPU). * **The 35x35mm Footprint:** Designed to cover medium-sized BGA (Ball Grid Array) packages. * **Thermal Interface Material (TIM):** The "C2" suffix indicates the inclusion of a high-performance phase-change material. This ensures low contact resistance between the chip surface and the aluminum. #### B. The Push-Pin Attachment Mechanism Unlike adhesive tapes, the push-pin system provides: * **Mechanical Pressure:** Ensures consistent contact force for better thermal transfer. * **Reliability:** Resistant to vibrations, making it suitable for automotive or industrial electronics. * **Pre-drilled Holes:** Requires the PCB to have specific hole patterns (typically 43mm apart for this series). #### C. Fin Design The **Straight Fin** profile is optimized for "forced convection." This means the part performs best when there is an active cooling fan pushing air across the fins. --- ### 3. Applications * **Embedded Computing:** Cooling microcontrollers or small processors on PCBs. * **Telecommunications:** Cooling chips on network switch line cards. * **Power Electronics:** Managing heat on power conversion modules.
    ✨ Follow-up Questions
    • ⤷ What is the specific PCB hole pattern required for the push-pin attachment?
    • ⤷ How does the T766 thermal material compare to standard thermal grease?
    • ⤷ What are the advantages of blue anodized aluminum in electronic cooling?