ATS-01A-40-C2-R0
AI

The **ATS-01A-40-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed for cooling electronic components such as CPUs, GPUs, or high-power semiconductors.
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### 1. Technical Specifications
The part number follows a specific nomenclature that defines its physical and thermal characteristics.
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Dimensions** | 54mm x 54mm x 25mm |
| **Attachment Type** | Push Pin (Plastic) |
| **Thermal Resistance** | ~1.45°C/W (at 200 LFM) |
| **Fin Style** | Straight Fin |
| **Thermal Interface** | T766 (Pre-applied Phase Change Material) |
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### 2. Electronic Integration Components
While the heat sink itself is passive, it is composed of several integrated mechanical/electronic thermal parts:
* **Heat Sink Body:** Extruded aluminum optimized for surface area. The "Blue Anodized" finish is not just for aesthetics; it provides surface protection and slightly improves radiation emissivity.
* **Push Pin Mechanism:** Includes a plastic pin and a compression spring. This ensures consistent **Clamping Force**, which is vital for minimizing the air gap between the heat sink and the electronic chip.
* **Thermal Interface Material (TIM):** Specifically the **T766** material. In electronics, this is the "part" that fills the microscopic air gaps between the semiconductor die and the metal heat sink to facilitate heat transfer.
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### 3. Usage Context
This component is typically found in the following electronic environments:
1. **Industrial PCs:** Cooling embedded processors.
2. **Network Switches:** Thermal management for ASICs and high-speed controllers.
3. **Power Electronics:** Dissipating heat from large MOSFET arrays or IGBTs.
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### 4. Thermal Performance Data
Performance varies based on the airflow (Linear Feet per Minute) within the electronic enclosure:
| Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) |
| :--- | :--- | :--- |
| 100 | 0.5 | 1.80 |
| 200 | 1.0 | 1.45 |
| 300 | 1.5 | 1.25 |
| 400 | 2.0 | 1.10 |
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- ⤷
What are the mounting hole diameter requirements for the ATS-01A-40-C2-R0?
- ⤷ How does the T766 thermal interface material compare to standard thermal grease?
- ⤷ Can this heat sink be used with a cooling fan attached directly to the fins?