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  • ATS-01A-40-C2-R0

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    The **ATS-01A-40-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed for cooling electronic components such as CPUs, GPUs, or high-power semiconductors. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions** | 54mm x 54mm x 25mm | | **Attachment Type** | Push Pin (Plastic) | | **Thermal Resistance** | ~1.45°C/W (at 200 LFM) | | **Fin Style** | Straight Fin | | **Thermal Interface** | T766 (Pre-applied Phase Change Material) | --- ### 2. Electronic Integration Components While the heat sink itself is passive, it is composed of several integrated mechanical/electronic thermal parts: * **Heat Sink Body:** Extruded aluminum optimized for surface area. The "Blue Anodized" finish is not just for aesthetics; it provides surface protection and slightly improves radiation emissivity. * **Push Pin Mechanism:** Includes a plastic pin and a compression spring. This ensures consistent **Clamping Force**, which is vital for minimizing the air gap between the heat sink and the electronic chip. * **Thermal Interface Material (TIM):** Specifically the **T766** material. In electronics, this is the "part" that fills the microscopic air gaps between the semiconductor die and the metal heat sink to facilitate heat transfer. --- ### 3. Usage Context This component is typically found in the following electronic environments: 1. **Industrial PCs:** Cooling embedded processors. 2. **Network Switches:** Thermal management for ASICs and high-speed controllers. 3. **Power Electronics:** Dissipating heat from large MOSFET arrays or IGBTs. --- ### 4. Thermal Performance Data Performance varies based on the airflow (Linear Feet per Minute) within the electronic enclosure: | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 1.80 | | 200 | 1.0 | 1.45 | | 300 | 1.5 | 1.25 | | 400 | 2.0 | 1.10 | ---
    ✨ Follow-up Questions
    • ⤷ What are the mounting hole diameter requirements for the ATS-01A-40-C2-R0?
    • ⤷ How does the T766 thermal interface material compare to standard thermal grease?
    • ⤷ Can this heat sink be used with a cooling fan attached directly to the fins?