The **ATS-01A-52-C2-R0** is a specific electronic component categorized as a **High-Performance Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). It is designed for thermal management in electronic systems where heat dissipation is critical for component longevity. --- ### Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-01A-52-C2-R0 | | **Heat Sink Type** | Push-Pin (Passive/Active Cooling) | | **Attachment Method** | Push-Pin (Plastic) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 36.83mm x 36.83mm x 25.00mm | | **Thermal Resistance** | Approx. 10.79°C/W (at 200 LFM) | --- ### Key Electronic & Mechanical Features #### 1. Heat Sink Design (Fine Pitch) The "52" series features a **Straight Fin** design. This allows for excellent airflow efficiency in environments where there is a constant stream of air (forced convection). The aluminum material is highly conductive, pulling heat away from the semiconductor (CPU, FPGA, or MOSFET). #### 2. Attachment Mechanism: Push-Pin Unlike adhesive-based heat sinks, the **R0** suffix indicates a push-pin attachment. - **Reliability:** Provides consistent pressure on the electronic component, ensuring a better interface with the Thermal Interface Material (TIM). - **Serviceability:** Can be removed and reinstalled more easily than epoxy-bonded sinks. #### 3. Thermal Interface Material (TIM) The "C2" in the part number typically refers to the **T766** phase-change thermal interface material or a similar high-performance pad pre-applied to the base. This fills microscopic air gaps between the heat sink and the electronic chip to maximize heat transfer. --- ### Application in Electronics This part is commonly found in: * **Networking Hardware:** High-speed routers and switches. * **Power Supplies:** Cooling voltage regulators. * **Embedded Systems:** Industrial PCs where space is constrained but thermal loads are high.