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  • ATS-01A-52-C3-R0

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    The **ATS-01A-52-C3-R0** is a high-performance **Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" series, designed for effective thermal management in electronic systems. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W)** | 35.00 mm x 35.00 mm | | **Height** | 25.00 mm | | **Pitch** | 4.70 mm | | **Thermal Resistance** | 10.70 °C/W (Unducted Flow @ 100 LFM) | --- ### 2. Design and Components This part is not an "electronic" component in the sense of having circuitry, but rather a **passive cooling mechanical component** critical for protecting electronics. * **Heat Sink Body:** Features a "Straight Fin" design. This maximizes surface area while allowing air to flow through efficiently, pulling heat away from the semiconductor (CPU, GPU, or MOSFET). * **pushPIN™ Attachment:** Instead of messy adhesives or fragile clips, it uses a spring-loaded pin mechanism. This ensures consistent pressure (TIM - Thermal Interface Material) against the chip for optimal heat transfer. * **Thermal Interface Material (TIM):** This specific model typically comes with **T412** pre-applied. T412 is a high-performance thermal tape that fills microscopic air gaps between the chip and the heat sink. --- ### 3. Application Use Cases This specific heat sink is commonly found in: 1. **Telecommunications:** Cooling high-speed processors in routers or switches. 2. **Embedded Systems:** Industrial PCs where space is limited but heat density is high. 3. **Power Supplies:** Managing heat in voltage regulators and power converters. --- ### 4. Cooling Performance (Airflow) Thermal resistance changes based on the speed of the air (measured in Linear Feet per Minute - LFM): | Air Velocity (LFM) | 100 (0.5 m/s) | 300 (1.5 m/s) | 500 (2.5 m/s) | | :--- | :--- | :--- | :--- | | **Thermal Resistance** | 10.70 °C/W | 3.20 °C/W | 2.10 °C/W |
    ✨ Follow-up Questions
    • ⤷ What is the difference between ducted and unducted airflow for this heat sink?
    • ⤷ How do I calculate if the 10.70 °C/W resistance is sufficient for my specific chip?
    • ⤷ Are there alternative mounting options if pushPIN is not supported by my PCB?