ATS-01A-52-C3-R0
AI

The **ATS-01A-52-C3-R0** is a high-performance **Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" series, designed for effective thermal management in electronic systems.
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### 1. Technical Specifications
The following table outlines the physical and thermal properties of the component:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Dimensions (L x W)** | 35.00 mm x 35.00 mm |
| **Height** | 25.00 mm |
| **Pitch** | 4.70 mm |
| **Thermal Resistance** | 10.70 °C/W (Unducted Flow @ 100 LFM) |
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### 2. Design and Components
This part is not an "electronic" component in the sense of having circuitry, but rather a **passive cooling mechanical component** critical for protecting electronics.
* **Heat Sink Body:** Features a "Straight Fin" design. This maximizes surface area while allowing air to flow through efficiently, pulling heat away from the semiconductor (CPU, GPU, or MOSFET).
* **pushPIN™ Attachment:** Instead of messy adhesives or fragile clips, it uses a spring-loaded pin mechanism. This ensures consistent pressure (TIM - Thermal Interface Material) against the chip for optimal heat transfer.
* **Thermal Interface Material (TIM):** This specific model typically comes with **T412** pre-applied. T412 is a high-performance thermal tape that fills microscopic air gaps between the chip and the heat sink.
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### 3. Application Use Cases
This specific heat sink is commonly found in:
1. **Telecommunications:** Cooling high-speed processors in routers or switches.
2. **Embedded Systems:** Industrial PCs where space is limited but heat density is high.
3. **Power Supplies:** Managing heat in voltage regulators and power converters.
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### 4. Cooling Performance (Airflow)
Thermal resistance changes based on the speed of the air (measured in Linear Feet per Minute - LFM):
| Air Velocity (LFM) | 100 (0.5 m/s) | 300 (1.5 m/s) | 500 (2.5 m/s) |
| :--- | :--- | :--- | :--- |
| **Thermal Resistance** | 10.70 °C/W | 3.20 °C/W | 2.10 °C/W |
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What is the difference between ducted and unducted airflow for this heat sink?
- ⤷ How do I calculate if the 10.70 °C/W resistance is sufficient for my specific chip?
- ⤷ Are there alternative mounting options if pushPIN is not supported by my PCB?