The **ATS-01A-54-C2-R0** is a specific high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is designed to dissipate heat from electronic components such as CPUs, GPUs, FPGAs, or power modules to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific model: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 35.00mm | | **Mounting Style** | Push-Pin (Plastic) | | **Thermal Resistance** | 6.70°C/W (at 200 LFM) | | **Attachment Method** | ATS-Push-Pin™ | | **Pressure Spring** | Stainless Steel (Standard) | --- ### 2. Key Features and Design * **Fin Design:** It utilizes a **Cross-Cut** fin pattern. This design allows for multidirectional airflow, making it highly efficient in complex chassis environments where air might not flow in a single straight line. * **Material Efficiency:** The aluminum construction offers a balance between lightweight design and high thermal conductivity. The blue anodized coating prevents oxidation and enhances emissivity. * **Attachment Mechanism:** The `R0` designation refers to the specific push-pin and spring kit. This mechanism provides consistent pressure against the component, ensuring an optimal thermal interface. --- ### 3. Thermal Performance Profile Thermal resistance varies based on the airflow (measured in Linear Feet per Minute - LFM). | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 | 7.00 | | 200 | 6.70 | | 400 | 4.80 | | 600 | 3.50 | --- ### 4. Typical Applications This part is commonly found in: 1. **Telecommunications:** High-speed routers and switches. 2. **Embedded Systems:** Industrial PC boards. 3. **Power Electronics:** Voltage regulator modules (VRMs).