The **ATS-01A-63-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heatsink**. It is designed to cool electronic components like CPUs, GPUs, or FPGAs in constrained environments. ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin (Plastic) with Springs | | **Fin Type** | Straight Fin | | **Dimensions (L x W x H)** | 40mm x 40mm x 20mm | | **Thermal Resistance** | 2.85°C/W @ 200 LFM | | **Interface Material** | T766 (Pre-applied Thermal Phase Change Material) | --- ### 2. Key Electronic & Mechanical Features #### A. Thermal Dissipation Performance The "63" series is optimized for airflow conditions within electronic enclosures. The thermal resistance values vary based on the air velocity (LFM - Linear Feet per Minute): * **100 LFM:** ~3.60 °C/W * **200 LFM:** ~2.85 °C/W * **400 LFM:** ~1.80 °C/W #### B. The Push-Pin Mounting System Unlike adhesive-based heatsinks, this part uses a **Push-Pin and Brass Spring** mechanism: * **Mechanical Stability:** Provides consistent pressure on the electronic chip, ensuring optimal contact with the thermal interface material. * **Durability:** The pins are made of durable plastic (usually UL94-V0 rated), and the springs provide the necessary compression force. * **Hole Pattern:** Requires pre-drilled holes in the PCB (Printed Circuit Board). #### C. Pre-Applied Thermal Interface Material (TIM) The part includes **T766 phase-change material**. This is a crucial "electronic part" of the assembly: * At room temperature, it is solid for easy handling. * At operating temperatures, it softens to fill microscopic air gaps between the component die and the heatsink base, maximizing heat transfer. --- ### 3. Application Use Cases * **Telecommunications:** Cooling high-speed signal processors. * **Embedded Systems:** Industrial PCs where vibration resistance is required (push-pins are more secure than tape). * **Power Electronics:** Dissipating heat from MOSFET arrays or voltage regulators.