The **ATS-01A-68-C2-R0** is a specific electronic cooling component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **maxiFLOW™** series of high-performance heat sinks. Below is a detailed breakdown of its specifications and electronic application characteristics. --- ### 1. General Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-01A-68-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Thermal Resistance** | 15.31°C/W (Unducted Flow @ 100 LFM) | --- ### 2. Technical Dimensions Precision in dimensions is critical for ensuring the heat sink fits within the PCB layout without interfering with adjacent components. * **Length:** 40.00 mm * **Width:** 40.00 mm * **Height:** 15.00 mm * **Pin Pitch:** 1.8 mm (Approx.) * **Weight:** Light-weight aluminum construction to prevent PCB warping. --- ### 3. Cooling Performance The "C2" in the part number typically refers to the thermal interface material (TIM) or specific performance grading. This unit is designed for **High-Performance Air Cooling**. * **Airflow Pattern:** Designed for both steady and turbulent airflow. * **Thermal Conductivity:** High, due to the specialized fin geometry which increases surface area without significantly increasing the footprint. * **Thermal Resistance Table (Example):** * @ 200 LFM: 9.42 °C/W * @ 400 LFM: 5.67 °C/W * @ 600 LFM: 4.41 °C/W --- ### 4. Mounting Mechanism: pushPIN™ One of the key "parts" of this assembly is the mounting system. The **pushPIN™** technology allows for: 1. **Secure Attachment:** A brass or plastic pin with a high-tension spring. 2. **Ease of Installation:** Quick manual assembly to the PCB via pre-drilled holes. 3. **Reliability:** Maintains constant pressure on the processor/chip to ensure optimal heat transfer through the Thermal Interface Material (TIM). --- ### 5. Application Use-Cases This component is typically found in: * **Network Switches/Routers:** Cooling high-speed processors. * **Industrial PCs:** Where compact, high-efficiency cooling is required. * **Power Supplies:** Managing heat in MOSFETs or voltage regulators. ---