ATS-01A-69-C2-R0
AI

The **ATS-01A-69-C2-R0** is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). It is designed specifically for cooling electronic components like CPUs, GPUs, and high-power transistors.
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### 1. Technical Specifications
The following table outlines the physical and thermal properties of this specific part:
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | pushPIN™ |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push Pin (Spring-loaded) |
| **Dimensions** | 45mm x 45mm x 20mm |
| **Thermal Resistance** | 11.31°C/W (Unducted Flow @ 100 LFM) |
| **Base Type** | Flat Bottom |
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### 2. Key Components & Design
The ATS-01A-69-C2-R0 is engineered for maximum thermal dissipation in constrained spaces:
* **Heat Sink Material:** Made of lightweight aluminum which provides excellent thermal conductivity while remaining cost-effective.
* **Fin Configuration:** It features a **Straight Fin** design. This is optimized for airflow passing across the device, allowing heat to escape through the increased surface area.
* **Attachment (pushPIN™):** It utilizes a spring-loaded push pin mechanism. This ensures a consistent pressure (Force) against the electronic component, which is critical for maximizing the effectiveness of the Thermal Interface Material (TIM).
* **Blue Anodized Coating:** This is not just for aesthetics; the anodized finish provides corrosion resistance and increased emissivity for better radiant heat transfer.
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### 3. Application Use-Cases
This part is typically found in the following electronic environments:
1. **Telecommunications:** Used on high-speed line cards and routers.
2. **Embedded Systems:** Ideal for cooling System-on-Chips (SoCs) in industrial computers.
3. **Power Electronics:** Dissipating heat from Voltage Regulators and MOSFETs.
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### 4. Thermal Performance Data
*Measured in °C/W (Lower is better)*
| Airflow Velocity (LFM) | 100 (0.5m/s) | 300 (1.5m/s) | 500 (2.5m/s) |
| :--- | :--- | :--- | :--- |
| **Unducted Flow** | 11.31 | 3.91 | 2.40 |
| **Ducted Flow** | 2.40 | 1.58 | 1.28 |
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How do I choose the correct Thermal Interface Material (TIM) for this heat sink?
- ⤷ What is the difference between ducted and unducted airflow in this context?
- ⤷ Are there alternative mounting options if push pins don't fit my PCB?