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  • ATS-01A-69-C2-R0

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    The **ATS-01A-69-C2-R0** is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). It is designed specifically for cooling electronic components like CPUs, GPUs, and high-power transistors. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Spring-loaded) | | **Dimensions** | 45mm x 45mm x 20mm | | **Thermal Resistance** | 11.31°C/W (Unducted Flow @ 100 LFM) | | **Base Type** | Flat Bottom | --- ### 2. Key Components & Design The ATS-01A-69-C2-R0 is engineered for maximum thermal dissipation in constrained spaces: * **Heat Sink Material:** Made of lightweight aluminum which provides excellent thermal conductivity while remaining cost-effective. * **Fin Configuration:** It features a **Straight Fin** design. This is optimized for airflow passing across the device, allowing heat to escape through the increased surface area. * **Attachment (pushPIN™):** It utilizes a spring-loaded push pin mechanism. This ensures a consistent pressure (Force) against the electronic component, which is critical for maximizing the effectiveness of the Thermal Interface Material (TIM). * **Blue Anodized Coating:** This is not just for aesthetics; the anodized finish provides corrosion resistance and increased emissivity for better radiant heat transfer. --- ### 3. Application Use-Cases This part is typically found in the following electronic environments: 1. **Telecommunications:** Used on high-speed line cards and routers. 2. **Embedded Systems:** Ideal for cooling System-on-Chips (SoCs) in industrial computers. 3. **Power Electronics:** Dissipating heat from Voltage Regulators and MOSFETs. --- ### 4. Thermal Performance Data *Measured in °C/W (Lower is better)* | Airflow Velocity (LFM) | 100 (0.5m/s) | 300 (1.5m/s) | 500 (2.5m/s) | | :--- | :--- | :--- | :--- | | **Unducted Flow** | 11.31 | 3.91 | 2.40 | | **Ducted Flow** | 2.40 | 1.58 | 1.28 |
    ✨ Follow-up Questions
    • ⤷ How do I choose the correct Thermal Interface Material (TIM) for this heat sink?
    • ⤷ What is the difference between ducted and unducted airflow in this context?
    • ⤷ Are there alternative mounting options if push pins don't fit my PCB?