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  • ATS-01A-70-C2-R0

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    The **ATS-01A-70-C2-R0** is a specific electronic cooling component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **pushPIN™** series of high-performance heat sinks designed for cooling integrated circuits (ICs) and other electronic components. --- ## 1. Technical Specifications The following table highlights the critical mechanical and thermal properties of this specific part number: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 45mm x 45mm x 25mm | | **Thermal Resistance (Flowing)** | 1.41 °C/W @ 100 LFM | | **Thermal Resistance (Static)** | 7.72 °C/W (Natural Convection) | | **Fin Configuration** | Straight Fin | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ## 2. Component Analysis To understand how this part functions within an electronic assembly, we can break it down into its primary sub-parts: ### A. The Heat Sink Body * **Geometry:** The 25mm height allows for significant surface area while maintaining a footprint compatible with standard BGA (Ball Grid Array) or LGA (Land Grid Array) chips. * **Material Choice:** Aluminum is used for its excellent thermal conductivity-to-weight ratio, ensuring heat is pulled away from the silicon die efficiently. ### B. The PushPIN™ Fastener Unlike adhesive tapes or simple clips, the pushPIN™ system uses a specific spring-loaded mechanism: * **Compression Spring:** Provides a precise amount of "clamping force" (pressure) to ensure the heat sink makes firm contact with the component. * **Brass/Plastic Pin:** These pins lock into pre-drilled holes on the Printed Circuit Board (PCB), ensuring the heat sink does not shift during vibration or shipping. ### C. Thermal Interface Material (TIM) The **T766** material pre-applied to the base is a high-performance thermal pad/grease. Its job is to fill microscopic air gaps between the CPU/GPU and the heat sink base, as air is a poor conductor of heat. --- ## 3. Part Number Decoder (Nomenclature) Understanding the "Electronic DNA" of the part through its SKU: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer: Advanced Thermal Solutions | | **01** | Series Type | | **A** | Attachment Type (pushPIN™) | | **70** | Specific Fin Pattern/Pitch | | **C2** | Material/Finish Code (Blue Anodized Aluminum) | | **R0** | RoHS Compliant / Revision Level | ---
    ✨ Follow-up Questions
    • ⤷ How do I calculate if the 1.41 \u00b0C/W thermal resistance is sufficient for my specific IC?
    • ⤷ What are the PCB hole diameter requirements for the pushPIN\u2122 attachment system?
    • ⤷ Can the T766 thermal interface material be replaced with a different compound for higher performance?