ATS-01A-70-C2-R0
AI

The **ATS-01A-70-C2-R0** is a specific electronic cooling component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **pushPIN™** series of high-performance heat sinks designed for cooling integrated circuits (ICs) and other electronic components.
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## 1. Technical Specifications
The following table highlights the critical mechanical and thermal properties of this specific part number:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Dimensions (L x W x H)** | 45mm x 45mm x 25mm |
| **Thermal Resistance (Flowing)** | 1.41 °C/W @ 100 LFM |
| **Thermal Resistance (Static)** | 7.72 °C/W (Natural Convection) |
| **Fin Configuration** | Straight Fin |
| **Thermal Interface Material (TIM)** | T766 (Pre-applied) |
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## 2. Component Analysis
To understand how this part functions within an electronic assembly, we can break it down into its primary sub-parts:
### A. The Heat Sink Body
* **Geometry:** The 25mm height allows for significant surface area while maintaining a footprint compatible with standard BGA (Ball Grid Array) or LGA (Land Grid Array) chips.
* **Material Choice:** Aluminum is used for its excellent thermal conductivity-to-weight ratio, ensuring heat is pulled away from the silicon die efficiently.
### B. The PushPIN™ Fastener
Unlike adhesive tapes or simple clips, the pushPIN™ system uses a specific spring-loaded mechanism:
* **Compression Spring:** Provides a precise amount of "clamping force" (pressure) to ensure the heat sink makes firm contact with the component.
* **Brass/Plastic Pin:** These pins lock into pre-drilled holes on the Printed Circuit Board (PCB), ensuring the heat sink does not shift during vibration or shipping.
### C. Thermal Interface Material (TIM)
The **T766** material pre-applied to the base is a high-performance thermal pad/grease. Its job is to fill microscopic air gaps between the CPU/GPU and the heat sink base, as air is a poor conductor of heat.
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## 3. Part Number Decoder (Nomenclature)
Understanding the "Electronic DNA" of the part through its SKU:
| Segment | Meaning |
| :--- | :--- |
| **ATS** | Manufacturer: Advanced Thermal Solutions |
| **01** | Series Type |
| **A** | Attachment Type (pushPIN™) |
| **70** | Specific Fin Pattern/Pitch |
| **C2** | Material/Finish Code (Blue Anodized Aluminum) |
| **R0** | RoHS Compliant / Revision Level |
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- ⤷
How do I calculate if the 1.41 \u00b0C/W thermal resistance is sufficient for my specific IC?
- ⤷ What are the PCB hole diameter requirements for the pushPIN\u2122 attachment system?
- ⤷ Can the T766 thermal interface material be replaced with a different compound for higher performance?