ATS-01A-77-C2-R0
AI

The **ATS-01A-77-C2-R0** is a specific part number for a high-performance **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. This component is part of their "maxiFLOW™" product line, designed primarily for cooling electronic components like CPUs, GPUs, or FPGAs.
---
### 1. Technical Specifications
The part number encodes specific physical and thermal characteristics:
| Property | Specification |
| :--- | :--- |
| **Material** | Aluminum (typically 6063) |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded pins) |
| **Dimensions** | 25mm x 25mm x 20mm |
| **Thermal Resistance** | Approx. 9.30°C/W (at 100 LFM) |
| **Flow Pattern** | maxiFLOW™ (Flared fin design) |
---
### 2. Key Features
* **maxiFLOW™ Geometry:** The fins are flared outwards. This design reduces pressure drop and increases surface area, allowing for better airflow intake and improved heat dissipation.
* **pushPIN™ Attachment:** It features a specialized attachment system that includes a brass tip and a stainless steel spring. This ensures a secure hold and provides the specific pressure needed for optimal thermal interface material (TIM) performance.
* **Blue Anodized Coating:** Beyond aesthetics, the anodization protects the aluminum from corrosion and slightly improves surface emissivity for radiation cooling.
* **Pre-assembled TIM:** Most "R0" variants come with high-performance Thermal Interface Material (Phase Change or Thermal Tape) pre-applied to the base.
---
### 3. Electronic Application
This heat sink is used to manage the **Thermal Design Power (TDP)** of semi-conductor devices. Without such a part, high-density chips would exceed their junction temperature limits, leading to:
1. **Thermal Throttling:** Reduced processing speed.
2. **Component Failure:** Permanent damage due to heat.
3. **Shortened Lifespan:** Accelerated aging of the silicon.
---
### 4. Thermal Performance Data
*Approximate values under varying airflows:*
| Air Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 1.0 m/s (200 LFM) | 6.00 |
| 2.0 m/s (400 LFM) | 4.40 |
| 3.0 m/s (600 LFM) | 3.70 |
---
- ⤷What are the specific hole patterns required on the PCB for the pushPIN attachment?
- ⤷ How does the flared fin design compare to straight fin heat sinks?
- ⤷ What thermal interface material is pre-applied to the ATS-01A-77-C2-R0?