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  • ATS-01A-77-C2-R0

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    The **ATS-01A-77-C2-R0** is a specific part number for a high-performance **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. This component is part of their "maxiFLOW™" product line, designed primarily for cooling electronic components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The part number encodes specific physical and thermal characteristics: | Property | Specification | | :--- | :--- | | **Material** | Aluminum (typically 6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Dimensions** | 25mm x 25mm x 20mm | | **Thermal Resistance** | Approx. 9.30°C/W (at 100 LFM) | | **Flow Pattern** | maxiFLOW™ (Flared fin design) | --- ### 2. Key Features * **maxiFLOW™ Geometry:** The fins are flared outwards. This design reduces pressure drop and increases surface area, allowing for better airflow intake and improved heat dissipation. * **pushPIN™ Attachment:** It features a specialized attachment system that includes a brass tip and a stainless steel spring. This ensures a secure hold and provides the specific pressure needed for optimal thermal interface material (TIM) performance. * **Blue Anodized Coating:** Beyond aesthetics, the anodization protects the aluminum from corrosion and slightly improves surface emissivity for radiation cooling. * **Pre-assembled TIM:** Most "R0" variants come with high-performance Thermal Interface Material (Phase Change or Thermal Tape) pre-applied to the base. --- ### 3. Electronic Application This heat sink is used to manage the **Thermal Design Power (TDP)** of semi-conductor devices. Without such a part, high-density chips would exceed their junction temperature limits, leading to: 1. **Thermal Throttling:** Reduced processing speed. 2. **Component Failure:** Permanent damage due to heat. 3. **Shortened Lifespan:** Accelerated aging of the silicon. --- ### 4. Thermal Performance Data *Approximate values under varying airflows:* | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 1.0 m/s (200 LFM) | 6.00 | | 2.0 m/s (400 LFM) | 4.40 | | 3.0 m/s (600 LFM) | 3.70 | ---
    ✨ Follow-up Questions
    • ⤷What are the specific hole patterns required on the PCB for the pushPIN attachment?
    • ⤷ How does the flared fin design compare to straight fin heat sinks?
    • ⤷ What thermal interface material is pre-applied to the ATS-01A-77-C2-R0?