The **ATS-01A-79-C2-R0** is a specific electronic part number referring to a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "superGRIP" product line designed for cooling integrated circuits (ICs) and components like CPUs, GPUs, or FPGAs. --- ### 1. Key Technical Specifications The part number encodes specific data about the physical and thermal properties of the component. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 25mm x 25mm x 30mm | | **Fin Style** | Straight Fin | | **Attachment Method** | superGRIP (Clip-on) | | **Thermal Resistance** | ~2.63 °C/W (at 200 LFM) | --- ### 2. Breakdown of the Part Number Advanced Thermal Solutions uses a standardized nomenclature to identify their cooling solutions: * **ATS**: Manufacturer prefix. * **01A**: Refers to the specific series or design family. * **79**: Represents the physical footprint and fin configuration code. * **C2**: Indicates the material and finish (Blue Anodized Aluminum). * **R0**: Version or revision code. --- ### 3. Electronic Design Features #### A. Attachment Mechanism (superGRIP™) Unlike traditional heat sinks that require holes in the Printed Circuit Board (PCB), this model uses a high-strength **clip-on** system. * **Plastic Frame Clip:** Attaches directly to the component (IC). * **Metal Spring Clip:** Applies steady pressure to the heat sink, ensuring constant contact with the chip without damaging the board. #### B. Thermal Performance The "Straight Fin" design is optimized for **forced-air cooling**. It allows air from a system fan to flow through the channels with minimal resistance, effectively wicking heat away from the silicon die. #### C. Thermal Interface Material (TIM) Usually, these parts come with a pre-applied thermal pad or require a specific thermal paste to fill the microscopic air gaps between the chip surface and the aluminum base of the heat sink. --- ### 4. Typical Applications * **Networking Hardware:** Routers, switches, and high-speed modems. * **Embedded Systems:** Industrial PCs and controllers. * **Power Electronics:** Cooling voltage regulators or small power modules.