The **ATS-01A-79-C3-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions, Inc. (ATS)**. It is part of the "push-pin" attachment family, designed to provide efficient cooling for electronic components such as CPUs, GPUs, and other high-heat-generating ICs. ### 1. Technical Specifications The following table summarizes the physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 25.0mm x 25.0mm x 30.0mm | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 2.63 °C/W (at 200 LFM) | | **Number of Fins** | 10 (Vertical) | | **Weight** | ~15 grams | --- ### 2. Key Design Elements #### A. Fin Geometry The heat sink features a **straight fin** design. Straight fins are optimized for unidirectional airflow (forced convection). The vertical orientation and spacing are engineered to minimize pressure drop while maximizing the surface area available for heat dissipation. #### B. Attachment Mechanism: Push-Pins The **"01A"** designation refers to the push-pin mounting style. * **Ease of Assembly:** Requires pre-drilled holes in the PCB. * **Standardized Tension:** Built-in springs provide consistent pressure on the thermal interface material (TIM), ensuring optimal heat transfer. * **Material:** The pins are typically made of durable plastic or brass, depending on the specific sub-series. #### C. Material and Coating * **Aluminum 6063:** Chosen for its high thermal conductivity and lightweight properties. * **Blue Anodizing:** This is not just aesthetic. Anodizing provides corrosion resistance, electrical insulation (to an extent), and increases the emissivity of the surface, which slightly improves radiative cooling. --- ### 3. Thermal Performance Profile The efficiency of the ATS-01A-79-C3-R0 depends heavily on the airflow (Linear Feet per Minute - LFM): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Natural/Low Convection) | 4.10 | | 200 (Standard) | 2.63 | | 400 (High Performance) | 1.80 | --- ### 4. Implementation Details To integrate this part into a circuit design, the PCB layout must account for the mounting holes: ```markdown * Hole Pattern: 2-hole diagonal * Hole Diameter: 3.0mm (standard for plastic push-pins) * Pitch: Variable based on the specific ATS '79' footprint series (check datasheet for exact X-Y coordinates). ```