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  • ATS-01A-80-C3-R0

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    The **ATS-01A-80-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed for cooling high-power semiconductors. --- ### 1. Technical Specifications Below is a breakdown of the physical and thermal properties of this specific part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (with Blue Anodized finish) | | **Mounting Style** | pushPIN™ | | **Dimensions** | 70mm x 70mm x 15mm | | **Thermal Resistance** | 1.90° C/W (@ 200 LFM) | | **Airflow Path** | Straight (optimized for ducted flow) | | **Attachment** | Plastic/Brass Push Pins & Springs | --- ### 2. Key Design Features #### A. maxiFLOW™ Geometry The fins are designed with a tapered base and a high-aspect-ratio layout. This geometry reduces pressure drop and increases the surface area exposed to the air, which maximizes heat dissipation in constrained spaces. #### B. pushPIN™ Attachment System This part uses a specific mounting mechanism known as **pushPIN™**. - It includes a pre-assembled compression spring and a push-pin. - It provides a constant, reliable pressure on the component (e.g., a CPU or BGA) to ensure optimal thermal interface contact. - It eliminates the need for messy adhesives or tapes. #### C. Thermal Interface Material (TIM) The "R0" at the end of the part number usually signifies the inclusion of a high-performance **Phase Change Material** or a thermal pad pre-applied to the base, ensuring no air gaps exist between the heat sink and the electronic chip. --- ### 3. Electronic Applications This part is commonly used in industrial and telecommunication hardware, including: 1. **Network Switches/Routers:** Cooling high-speed processing chips. 2. **FPGAs & ASICs:** Managing the high heat density of programmable logic devices. 3. **Power Supplies:** Dissipating heat from MOSFETs or IGBTs. 4. **Embedded Systems:** Used where height is restricted (15mm profile) but high cooling capacity is required. --- ### 4. Part Number Breakdown * **ATS**: Advanced Thermal Solutions (Manufacturer) * **01**: Series Identifier * **A**: Geometry Type (maxiFLOW) * **80**: Specific sizing/dimension code * **C3**: Material/Finish (Blue Anodized Aluminum) * **R0**: Package/TIM configuration
    ✨ Follow-up Questions
    • ⤷ What is the thermal resistance of this part at different LFM (Linear Feet per Minute) speeds?
    • ⤷ What are the compatible PCB hole sizes for the pushPIN mounting system?
    • ⤷ How does the 'Straight Fin' design compare to 'Cross-Cut' designs for electronic cooling?