ATS-01A-80-C3-R0
AI

The **ATS-01A-80-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed for cooling high-power semiconductors.
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### 1. Technical Specifications
Below is a breakdown of the physical and thermal properties of this specific part:
| Parameter | Specification |
| :--- | :--- |
| **Material** | Aluminum (with Blue Anodized finish) |
| **Mounting Style** | pushPIN™ |
| **Dimensions** | 70mm x 70mm x 15mm |
| **Thermal Resistance** | 1.90° C/W (@ 200 LFM) |
| **Airflow Path** | Straight (optimized for ducted flow) |
| **Attachment** | Plastic/Brass Push Pins & Springs |
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### 2. Key Design Features
#### A. maxiFLOW™ Geometry
The fins are designed with a tapered base and a high-aspect-ratio layout. This geometry reduces pressure drop and increases the surface area exposed to the air, which maximizes heat dissipation in constrained spaces.
#### B. pushPIN™ Attachment System
This part uses a specific mounting mechanism known as **pushPIN™**.
- It includes a pre-assembled compression spring and a push-pin.
- It provides a constant, reliable pressure on the component (e.g., a CPU or BGA) to ensure optimal thermal interface contact.
- It eliminates the need for messy adhesives or tapes.
#### C. Thermal Interface Material (TIM)
The "R0" at the end of the part number usually signifies the inclusion of a high-performance **Phase Change Material** or a thermal pad pre-applied to the base, ensuring no air gaps exist between the heat sink and the electronic chip.
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### 3. Electronic Applications
This part is commonly used in industrial and telecommunication hardware, including:
1. **Network Switches/Routers:** Cooling high-speed processing chips.
2. **FPGAs & ASICs:** Managing the high heat density of programmable logic devices.
3. **Power Supplies:** Dissipating heat from MOSFETs or IGBTs.
4. **Embedded Systems:** Used where height is restricted (15mm profile) but high cooling capacity is required.
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### 4. Part Number Breakdown
* **ATS**: Advanced Thermal Solutions (Manufacturer)
* **01**: Series Identifier
* **A**: Geometry Type (maxiFLOW)
* **80**: Specific sizing/dimension code
* **C3**: Material/Finish (Blue Anodized Aluminum)
* **R0**: Package/TIM configuration
- ⤷
What is the thermal resistance of this part at different LFM (Linear Feet per Minute) speeds?
- ⤷ What are the compatible PCB hole sizes for the pushPIN mounting system?
- ⤷ How does the 'Straight Fin' design compare to 'Cross-Cut' designs for electronic cooling?