The **ATS-01A-81-C2-R0** is a specific part number for a high-performance **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. This component belongs to the "maxiFLOW™" series, designed for cooling electronic components like CPUs, GPUs, and FPGAs. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. | | **Part Number** | ATS-01A-81-C2-R0 | | **Material** | Aluminum (with Blue Anodized Finish) | | **Dimensions (L x W x H)** | 40mm x 40mm x 20mm | | **Attachment Method** | maxiGRIP™ (Frame Clip) | | **Thermal Resistance** | 3.03 °C/W @ 200 LFM | | **Fin Style** | Straight Fin | --- ### 2. Key Design Features * **maxiFLOW™ Geometry:** The heat sink features a tapered fin design that increases the surface area for maximum heat dissipation while reducing the pressure drop of the airflow. * **maxiGRIP™ Attachment:** It uses a specialized plastic frame clip and a stainless steel "X-clip." This allows for high-pressure contact between the heat sink and the chip without needing to drill holes in the PCB. * **Interface Material:** Usually comes pre-applied with a **Phase Change Material (PCM)** or high-performance thermal tape to ensure low thermal resistance at the contact point. --- ### 3. Applications This part is typically found in: 1. **Networking Hardware:** Switches, routers, and high-speed modems. 2. **Industrial PCs:** Compact systems requiring passive or active cooling. 3. **Embedded Systems:** Cools high-performance microprocessors in confined spaces. --- ### 4. Thermal Performance Data The performance is highly dependent on the airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 3.03 | | 400 (2.0 m/s) | 1.95 | | 600 (3.0 m/s) | 1.62 | ---