ATS-01A-82-C2-R0
AI

The **ATS-01A-82-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push-pin" series designed for cooling semiconductor components such as CPUs, GPUs, or high-power ASICs.
---
### 1. Technical Specifications
Below are the primary mechanical and thermal characteristics of this part:
| Parameter | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | Blue Anodized Push-Pin Heat Sink |
| **Material** | Aluminum |
| **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 25.00mm |
| **Fin Style** | Straight (Vertical Fins) |
| **Attachment Type** | Push-Pin (Plastic) |
| **Spring Type** | Compression Spring |
| **Interface Material** | T766 (Phase Change Material/Thermal Tape) |
---
### 2. Key Components & Materials
#### A. The Heat Sink Body
The body is made of **Aluminum 6063**, which offers high thermal conductivity while remaining lightweight. The surface is treated with a **Blue Anodized** finish. This coating is not just for aesthetics; it provides:
* Corrosion resistance.
* Increased surface emissivity (improving radiant heat transfer).
* Electrical insulation (to prevent short-circuits if the sink touches nearby components).
#### B. Mounting Hardware (Push-Pin & Spring)
The "R0" designation refers to the mounting assembly.
* **Plastic Push-Pins:** These provide a secure, standardized method of attachment to the PCB.
* **Compression Springs:** These apply a precise amount of downward pressure (clamping force) on the electronic chip to ensure maximum contact with the thermal interface material.
#### C. Thermal Interface Material (TIM)
The base of the ATS-01A-82-C2-R0 typically comes pre-applied with a thermal pad or phase-change material. This fills the microscopic air gaps between the chip surface and the heat sink base, significantly reducing **Contact Resistance**.
---
### 3. Application Use Cases
This specific heat sink is categorized as a "board-level" component. It is commonly found in:
* **Networking Equipment:** Routers, switches, and base stations.
* **Embedded Systems:** Industrial PCs and IoT gateways.
* **Power Supplies:** Cooling voltage regulators or MOSFETs.
### 4. Part Number Decoder
Understanding the "ATS" nomenclature:
* **ATS:** Manufacturer (Advanced Thermal Solutions).
* **01A:** Series designation.
* **82:** Specific model/fin configuration.
* **C2:** Material/Finish code (typically Aluminum/Blue Anodized).
* **R0:** Packaging/Revision code.
---
- ⤷
What is the thermal resistance value (Celsius/Watt) for the ATS-01A-82-C2-R0?
- ⤷ What is the recommended PCB hole pattern for this push-pin heat sink?
- ⤷ Can this heat sink be used with a fan for active cooling?