The **ATS-01A-85-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed for cooling electronic components such as CPUs, GPUs, and other integrated circuits (ICs). --- ### 1. Technical Specifications The following table summarizes the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Dimensions** | 35.00mm x 35.00mm | | **Height** | 10.00mm | | **Attachment Method** | Push-Pin (Brass) | | **Thermal Resistance** | 23.98°C/W (Unducted Flow @ 200 LFM) | | **Fin Style** | Straight Fin | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Electronic Features #### A. Thermal Management The primary purpose of this part is to dissipate heat from surface-mount devices (SMD). It prevents **thermal throttling** and hardware failure by ensuring the junction temperature of the semiconductor stays within safe operating limits. #### B. Push-Pin Attachment Unlike adhesive-based heat sinks, the ATS-01A-85-C2-R0 uses a mechanical push-pin system. * **Spring-loaded mechanism:** Provides consistent pressure for optimal contact with the electronic component. * **Reliability:** Mechanical mounting is preferred in high-vibration environments (e.g., aerospace or industrial servers) compared to thermal tape. #### C. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied. This is a high-performance thermal grease or pad that fills the microscopic air gaps between the component die and the heat sink base, significantly reducing thermal impedance. --- ### 3. Usage Examples * **Embedded Systems:** Cooling FPGA or ASIC chips on PCBs. * **Networking Gear:** Heat dissipation for high-speed switch controllers. * **Power Electronics:** Managing heat for voltage regulators or power modules.