The **ATS-01A-87-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (Body), Copper (optional base variations) | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Thermal Resistance** | ~13.30°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 35mm x 35mm x 20mm | | **Finish** | Blue Anodized | | **Thermal Interface Material (TIM)** | T412 (Pre-applied) | --- ### Key Components & Features #### 1. Heat Sink Body The core is made of aluminum, chosen for its high thermal conductivity and lightweight properties. The "87" in the part number refers to a specific fin configuration designed for optimized airflow. #### 2. pushPIN™ Attachment System This part utilizes a specific mechanical attachment system: * **Ease of Install:** Allows for quick mounting to the PCB without the need for specialized tools. * **Spring-Loaded:** Provides consistent pressure (force) against the electronic component to ensure maximum thermal transfer. #### 3. Blue Anodized Finish The surface is treated with a blue anodized coating. This is not just for aesthetics; it provides: * Increased corrosion resistance. * Improved surface emissivity (slight improvement in radiative heat transfer). * Electrical insulation of the surface. #### 4. Thermal Interface Material (TIM) The part comes with **T412** pre-applied. This is a "Phase Change" or high-performance thermal grease that fills the microscopic air gaps between the heat sink and the electronic chip, significantly reducing thermal resistance. --- ### Typical Applications * **Integrated Circuits (ICs):** Cooling of BGA (Ball Grid Array) packages. * **Power Supplies:** Managing heat in voltage regulators. * **Telecommunications:** Used in routers and switches where airflow is often directed across the board. --- ### Performance Data (Airflow) | Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 | 13.30 | | 300 | 4.60 | | 500 | 3.10 | ---