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  • ATS-01A-90-C2-R0

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    The **ATS-01A-90-C2-R0** is a high-performance electronic component specifically categorized as a **Heat Sink**, designed by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" attachment series, commonly used for cooling Integrated Circuits (ICs) and other electronic chips. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part number: | Feature | Specification | | :--- | :--- | | **Product Type** | Heat Sink (Passive) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Thermal Resistance** | 6.36°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 35.0mm x 35.0mm x 25.0mm | | **Fin Style** | Straight Fin | --- ### 2. Breakdown of the Part Number The part number is coded to represent specific engineering values: * **ATS**: Advanced Thermal Solutions (Manufacturer). * **01**: Series type (Push-pin attachment). * **A**: Aluminum material. * **90**: Specific dimension/geometry code. * **C2**: Thermal Interface Material (TIM) and Fin configuration. In this case, it usually indicates the use of **T766** phase change material. * **R0**: RoHS compliance status (Revision 0). --- ### 3. Key Electronic Functions While the heat sink itself is a mechanical part, its role in an electronic system is critical for performance: 1. **Thermal Management:** It increases the surface area of a hot component (like a BGA processor or FPGA), allowing heat to dissipate into the surrounding air. 2. **Protection:** By maintaining the junction temperature ($T_j$) below the manufacturer's limit, it prevents **Thermal Throttling** and permanent hardware failure. 3. **Mechanical Stability:** The "Push-Pin" design utilizes a built-in spring mechanism to apply consistent pressure across the surface of the chip, ensuring the Thermal Interface Material (TIM) fills all microscopic air gaps. --- ### 4. Implementation Example If you were integrating this into a PCB design, your CAD library would need the following footprint data: ```markdown # PCB Layout Considerations - Hole Diameter: 3.0mm (standard for brass push-pins) - Hole Pitch: 40.5mm (approximate center-to-center) - Keep-out Zone: 37mm x 37mm (to account for fin overhang) ```
    ✨ Follow-up Questions
    • ⤷ What is the difference between blue anodized and black anodized heat sinks?
    • ⤷ How do I calculate the required airflow (LFM) for this heat sink?
    • ⤷ Can this heat sink be used with a custom fan attachment?