ATS-01A-90-C2-R0
AI

The **ATS-01A-90-C2-R0** is a high-performance electronic component specifically categorized as a **Heat Sink**, designed by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" attachment series, commonly used for cooling Integrated Circuits (ICs) and other electronic chips.
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### 1. Technical Specifications
The following table outlines the physical and thermal characteristics of this specific part number:
| Feature | Specification |
| :--- | :--- |
| **Product Type** | Heat Sink (Passive) |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Brass) |
| **Thermal Resistance** | 6.36°C/W (at 200 LFM) |
| **Dimensions (L x W x H)** | 35.0mm x 35.0mm x 25.0mm |
| **Fin Style** | Straight Fin |
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### 2. Breakdown of the Part Number
The part number is coded to represent specific engineering values:
* **ATS**: Advanced Thermal Solutions (Manufacturer).
* **01**: Series type (Push-pin attachment).
* **A**: Aluminum material.
* **90**: Specific dimension/geometry code.
* **C2**: Thermal Interface Material (TIM) and Fin configuration. In this case, it usually indicates the use of **T766** phase change material.
* **R0**: RoHS compliance status (Revision 0).
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### 3. Key Electronic Functions
While the heat sink itself is a mechanical part, its role in an electronic system is critical for performance:
1. **Thermal Management:** It increases the surface area of a hot component (like a BGA processor or FPGA), allowing heat to dissipate into the surrounding air.
2. **Protection:** By maintaining the junction temperature ($T_j$) below the manufacturer's limit, it prevents **Thermal Throttling** and permanent hardware failure.
3. **Mechanical Stability:** The "Push-Pin" design utilizes a built-in spring mechanism to apply consistent pressure across the surface of the chip, ensuring the Thermal Interface Material (TIM) fills all microscopic air gaps.
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### 4. Implementation Example
If you were integrating this into a PCB design, your CAD library would need the following footprint data:
```markdown
# PCB Layout Considerations
- Hole Diameter: 3.0mm (standard for brass push-pins)
- Hole Pitch: 40.5mm (approximate center-to-center)
- Keep-out Zone: 37mm x 37mm (to account for fin overhang)
```
- ⤷
What is the difference between blue anodized and black anodized heat sinks?
- ⤷ How do I calculate the required airflow (LFM) for this heat sink?
- ⤷ Can this heat sink be used with a custom fan attachment?